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PROCEEDINGS VOLUME 1594

Process Module Metrology, Control and Clustering
Editor(s): Cecil J. Davis; Irving P. Herman; Terry R. Turner

*This item is only available on the SPIE Digital Library.


Volume Details

Volume Number: 1594
Date Published: 1 January 1992

Table of Contents
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Learning opportunities through the use of cluster tools
Author(s): Thomas E. Seidel; Michael R. Stark
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Equipment improvement methodology
Author(s): Kevin Lally
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Integrated deposition of TiN barrier layers in cluster tools
Author(s): J. P. Seidel; W. Wachter; William M. Triggs; Robert P. Hall
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Cluster tool technology
Author(s): John R. Hauser; Syed A. Rizvi
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Open architecture cluster tool: communication and user interface integration
Author(s): Fred Wong; George E. Zilberman
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Single-wafer high-pressure oxidation
Author(s): Charles A. Boitnott; David R. Craven
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Benefits of cluster tool architecture for implementation of evolutionary equipment improvements and applications
Author(s): Brad Hansen
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Dynamic design processing of integrated circuits for an "on target" end product
Author(s): Renate Sitte; Sima Dimitrijev; H. Barry Harrison
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Moss-Burstein shift in infrared materials under different physical conditions
Author(s): Kamakhya Prasad Ghatak
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Photoemission from periodic structure of graded superlattices under magnetic field
Author(s): Kamakhya Prasad Ghatak
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VLSI process expert diagnostic system
Author(s): Michael E. Parten; Robert F. Tyson; Atindra K. Mitra; Jerry Lovelace
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In-situ monitoring of DC saddle-field plasma-assisted deposition of amorphous silicon and silicon nitride
Author(s): Roman V. Kruzelecky; Mohamed Boumerzoug; Peter Mascher; Milton Harry; Stefan Zukotynski
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In-situ film thickness measurements for real-time monitoring and control of advanced photoresist track coating systems
Author(s): Thomas E. Metz; Richard N. Savage; Horace O. Simmons
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Mass spectrometric and optical emission diagnostics for rf plasma reactors
Author(s): James K. Olthoff; James R. Roberts; R. J. Van Brunt; James R. Whetstone; Mark A. Sobolewski; S. Djurovic
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Electrical characterization of rf plasmas
Author(s): Paul A. Miller
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Application of chemometrics to optical emission spectroscopy for plasma monitoring
Author(s): Michael P. Splichal; Harold M. Anderson
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Application of thermal imaging methodology for plasma etching diagnosis
Author(s): Vipulkumar Patel; Walter F. Kosonocky; S. Ayyagari; Mehul Patel; Bawa Singh
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In-situ diagnostics, monitoring, and metrology
Author(s): Glenn Engel; Pat Solomon
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In-process thin film thickness measurement and control
Author(s): Steven A. Henck
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Categories of process variables: robustness optimization, uniformity tuning, and mean adjustment
Author(s): Sungdo Ha; Emanuel Sachs
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Etch process characterization using neural network methodology: a case study
Author(s): Michael T. Mocella; James A. Bondur; Terry R. Turner
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Open-loop predictive control of plasma etching of tungsten using an in-situ film thickness sensor
Author(s): Jerry A. Stefani; Keith J. Brankner; Rhett Barry Jucha; William T. Pu; Mark A. Graas
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On-line process-model-based control of a plasma etcher
Author(s): Michael E. Parten; R. Russell Rhinehart; Vikram Singh
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Application of artificial neural networks to real-time control of plasma processes
Author(s): Daniel S. Camporese
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Application of adaptive equipment models to a photolithographic process
Author(s): Bart J. Bombay; Costas J. Spanos
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Adaptive photolithography control using development time manipulation
Author(s): Robert A. Soper; Duncan A. Mellichamp; Dale E. Seborg
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Raman scattering as an in-situ optical diagnostic
Author(s): Irving P. Herman
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Light scattering methods for semiconductor process monitoring and control
Author(s): Richard A. Gottscho; Matthew Vernon; Jeffrey A. Gregus; E. Yoon; K. P. Giapis; Todd R. Hayes; William S. Hobson; Lee M. Clark; J. Kruskal; Diane Lambert; Avi Kornblit; D. Sinatore
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Effects of feature edges on thickness readings of thin oxides
Author(s): Jon L. Opsal; David Willenborg; Jeffrey T. Fanton; Susan M. Kelso; Jim P. Simmons; Allan Rosencwaig
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Novel microspot dielectric film thickness measurement system
Author(s): David Willenborg; Susan M. Kelso; Jon L. Opsal; Jeffrey T. Fanton; Allan Rosencwaig
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Time-resolved study of excimer laser ablation of thin organic films from a metal surface
Author(s): Stephan Herminghaus; Paul Leiderer
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High-resolution surface plasmon measurements: a sensitive probe for thickness and structural information of ultrathin films
Author(s): Uwe Albrecht; H. Dilger; P. Evers; Paul Leiderer
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Infrared diagnostics for semiconductor process monitoring
Author(s): James A. O'Neill
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Ion velocity distributions in electron cyclotron resonance plasmas
Author(s): Richard A. Gottscho; Toshiki Nakano; Nader Sadeghi; Dennis J. Trevor; Rod W. Boswell
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Particle spatial distributions in low-pressure discharges
Author(s): John E. Daugherty; Michael D. Kilgore; David B. Graves
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Application of optical emission diagnostics and control related to semiconductor processing
Author(s): Gregory Viloria; Richard N. Savage
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Optical emission spectroscopy as a process monitor for triod ion plating with TiN
Author(s): Mohamed Boumerzoug; Peter Mascher; Douglas R. Nagy
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Optical characterization of thin film laser deposition processes
Author(s): Peter K. Schenck; David W. Bonnell; John W. Hastie; Lawrence P. Cook; C. K. Chiang
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Infrared diode laser and laser-induced fluorescence diagnostics of an electron cyclotron resonance plasma etching tool
Author(s): R. Claude Woods; R. L. McClain; L. J. Mahoney; E. A. Den Hartog; H. Persing; J. S. Hamers
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Tessellated probe as an aid to process development
Author(s): Neil M. P. Benjamin; K. R. Krieg; Gaylen T. Grover
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In-situ monitoring of semiconductor wafer temperature using infrared interferometry
Author(s): C. F. A. van Os; Brian N. Chapman
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