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PROCEEDINGS VOLUME 11328

Design-Process-Technology Co-optimization for Manufacturability XIV
Editor(s): Chi-Min Yuan
For the purchase of this volume in printed format, please visit Proceedings.com

Volume Details

Volume Number: 11328
Date Published: 13 April 2020

Table of Contents
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Front Matter: Volume 11328
Author(s): Proceedings of SPIE
Machine Learning using retarget data to improve accuracy of fast lithographic hotspot detection
Author(s): Aliaa Kabeel; Wael ElManhawy; Joe Kwan; Asmaa Rabie; Mohamed Ismail; Ahmed Khater; Sarah Rizk
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Concurrent design rule, OPC and process optimization in EUV Lithography (Conference Presentation)
Author(s): Dongbo Xu; Werner Gillijns; Ling Ee Tan; Jae Uk Lee; Ryoung-Han Kim
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Implementing Machine Learning OPC on product layouts
Author(s): Hesham Abdelghany; Kevin Hooker; Marco Guajardo; Chia-Chun Lu
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Advanced memory cell design optimization with inverse lithography technology
Author(s): Jiro Higuchi; Weiting Wang; Takamasa Takaki; Hiromitsu Mashita; Shigeki Nojima; Ahmed Omran; Ken Hanafusa; Seunghee Baek; Ryan Chen; Yukio Asaka; Kyle Braam; Hironobu Taoka; Guangming Xiao
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Standard cell architectures for N2 node: transition from FinFET to nanosheet and to forksheet device
Author(s): Bilal Chehab; P. Weckx Sr.; J. Ryckaert Sr.; D. Jang Sr.; D. Verkest; A. Spessot
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Approaches for full coverage physical design space exploration and analysis by synthetic layout generation
Author(s): Marwah Shafee; Joe Kwan; Wael El-Manhawy; Aliaa Kabeel; Sarah Risk; Jongha Park; SeungJo Lee; Jin Hee Kim; Mostafa Alaa; Mohamed Bahnasawi; Abdelrahman Abdelrazek; Sherif Hammouda; Kareem Madkour; Nabil Sabry
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An automated system for checking process friendliness and routability of standard cells
Author(s): I-Lun Tseng; Punitha Selvam; Zhao Chuan Lee; Vikas Tripathi; Chun Ming Tommy Yip; Jonathan Yoong Seang Ong
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Sequential 3D standard cell 4T architecture using design crenellation and self-aligned MOL for N2 technology and beyond
Author(s): Pieter Weckx; Bilal Chehab; Julien Ryckaert; Diederik Verkest; Alessio Spessot
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A comparative analysis of EUV sheet and gate patterning for beyond 7nm gate all around stacked nanosheet FET’s (Conference Presentation)
Author(s): Indira Seshadri; Praveen Joseph; Stuart A. Sieg; Tao Li; Wenyu Xu; Eric Miller; Dan J. Dechene; Andrew Greene; Carl Radens; Jingyun Zhang; Yann Mignot; Pietro Montanini; Mary Breton; Veeraraghavan Basker; Nelson Felix
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DTCO acceleration to fight scaling stagnation
Author(s): Lars Liebmann; Daniel Chanemougame; Peter Churchill; Jonathan Cobb; Chia-Tung Ho; Victor Moroz; Jeffrey Smith
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Dynamic pattern matching flow to enable low escape rate weak point detection
Author(s): Uwe Paul Schroeder; Janam Bakshi; Ahmed Mounir Elsemary; Fadi Batarseh
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Integrating enhanced hotspot library into manufacturing OPC correction flow
Author(s): Bradley J. Falch; Linghui Wu; John Tsai; Elsley Tan; Jiunhau Fu; Tengyen Huang; Chuncheng Liao
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Exploring patterning limit and enhancement techniques to improve printability of 2D shapes at 3nm node
Author(s): Rehab Kotb; Ahmed Hamed-Fatehy; James Word
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Foundry approach for layout risk assessment through comprehensive pattern harvesting and large-scale data analysis
Author(s): Monisa Ramesh Babu; Shenghua Song; Qian Xie; Pouya Rezaeifakhr; Eric Chiu; Joo Hyun Park; Deborah Ryan; Kiruthika Murali; Praneetha Poluju; Shobhit Malik; Haizhou Yin; Sriram Madhavan; Panneerselvam Venkatachalam
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Process related yield risk mitigation with in-design pattern replacement for system ICs manufactured at advanced technology nodes
Author(s): Jaehwan Kim; Jin Kim; Byungchul Shin; Sangah Lee; Jae-Hyun Kang; Joong-Won Jeon; Piyush Pathak; Jac Condella; Frank E. Gennari; Philippe Hurat; Ya-Chieh Lai
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Systematic DTCO flow for yield improvement at 14/12nm technology node
Author(s): Xiaojing Su; Yayi Wei; Rui Chen; Yajuan Su; Lisong Dong; Joe Kwan; Recoo Zhang; Chunshan Du; Qijian Wan; Xinyi Hu
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Co-optimizing DFM enhancements and their impact on layout-induced circuit performance for analog designs
Author(s): Lynn Wang; Michael Simcoe; Vikas Mehrotra; Gail Katzman; Rais Huda; Zhao Chuan Lee; Janam Bakshi; Ahmed Abdulghany; Uwe Paul Schroeder; Sriram Madhavan
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Enabling nanoimprint simulator for quality verification; process-design co-optimization toward high volume manufacturing
Author(s): Junichi Seki; Yuichiro Oguchi; Naoki Kiyohara; Koshiro Suzuki; Kohei Nagane; Shintaro Narioka; Takahiro Nakayama; Yoshihiro Shiode; Sentaro Aihara; Toshiya Asano
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Process variation-aware mask optimization with iterative improvement by subgradient method and boundary flipping
Author(s): Rina Azuma; Yukihide Kohira; Tomomi Matsui; Atsushi Takahashi; Chikaaki Kodama
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Progression of Logic Device and DTCO to enable advance scaling (Conference Presentation)
Author(s): Satadru Sarkar; Bilal Chehab; Julien Ryckaert; Myung Hee Na; Alessio Spessot
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Efficient design of guard rings and antenna diodes to improve manufacturability of FDSOI circuits
Author(s): Chi-Min Yuan; Dave Tipple
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Cost-performance optimization of fine-pitch W2W bonding: functional system partitioning with heterogeneous FEOL/BEOL configurations
Author(s): Dragomir Milojevic; Eric Beyne; Geert Van der Plas; Jane Wang; Peter Debacker
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How utilizing curvilinear design enables better manufacturing process window
Author(s): Ryan Pearman; Don O'Riordan; Jeff Ungar; Mariusz Niewczas; Leo Pang; Aki Fujimura
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Holistic method for reducing overlay error at the 5nm node and beyond
Author(s): Robert Socha
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New approaches to physical verification closure and cloud computing come to the rescue in the EUV era
Author(s): John Ferguson
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Multi-varied implementations with common underpinnings in design technology co-optimization
Author(s): Kevin Lucas; Victor Moroz; John Kim; Soo-Han Choi; Tim Tsuei
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An advanced and efficient methodology for process setup and monitoring by using process stability diagnosis in computational lithography
Author(s): Lijun Chen; Jun Zhu; Xuedong Fan; Haichang Zheng; Xiaolong Wang; Yancong Ge; Yu Zhang; Abhishek Vikram; Guojie Cheng; Hui Wang; Qing Zhang; Wenkui Liao
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Via optimization methodology for enhancing robustness of design at 14/12nm technology node
Author(s): Xiaojing Su; Libin Zhang; Yayi Wei; Rui Chen; Yajuan Su; Lisong Dong; Chunshan Du; Qijian Wan; Xinyi Hu
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Explore process weak patterns for manufacturing friendly design
Author(s): Jet Jiang; Frank Hou; Gavin Li; Marfe Ma; Kuan Hu; Chunshan Du; Qijian Wan; Zhengfang Liu; Xinyi Hu; Elven Huang; Wael ElManhawy
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VIA design optimization for fast yield ramping in advanced nodes
Author(s): Min Wang; Yizhong Zhang; Shirui Yu; Xinyi Hu; Qijian Wan; Zhengfang Liu; Zhixi Chen; Chunshan Du
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Early detection of Cu pooling with advanced CMP modeling
Author(s): Single Hsu; Ethan Wang; Eason Lin; Tamba Gbondo-Tugbawa; Aaron Gower-Hall; Brian Lee; Jansen Chee; Ya-Chieh Lai
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CMP simulation-based dummy fill optimization
Author(s): Liwei Jiang; Yun Cao; Jiao Zhang; Fang Wei; Zhengfang Liu; Chunshan Du; Ruben Ghulghazaryan; Davit Piliposyan; Jeff Wilson; Qijian Wan; Xinyi Hu; Zhixi Chen
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An efficient way to accelerate litho hotspot checking
Author(s): Jet Jiang; Gavin Li; Frank Hou; Qijian Wan; Xinyi Hu; Zhengfang Liu; Zhixi Chen; Chunshan Du
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Kissing corner handling in advanced nodes
Author(s): Harold Mendoza; Gazi Huda
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DFM: “Design for Manufacturing” or “Design Friendly Manufacturing” How to convert extra EPE budget into design freedom by SMO
Author(s): Wenzhan Zhou; Hung-Wen Chao; Yu Zhang; Chan-Yuan Hu; QiXin Xu; Quan Gan; Ao Chen; Gen-Sheng Gao
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Fast OPC repair flow based on machine learning
Author(s): Bailing Shi; Rock Deng; Zhongli Shu; Yu Zhu; Yuanying Tu; Sun Chen
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A comprehensive standard cell library qualification to prevent lithographic challenges
Author(s): Xinyi Hu; Qijian Wan; Zhengfang Liu; Zhixi Chen; Chunshan Du
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Implementing Machine Learning for OPC retargeting
Author(s): Kevin Hooker; Marco Guajardo; Nai-Chia Cheng; Guangming Xiao
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A feature selection method for weak classifier based hotspot detection
Author(s): Hidekazu Takahashi; Hiroki Ogura; Shimpei Sato; Atsushi Takahashi; Chikaaki Kodama
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Unsupervised machine learning based CD-SEM image segregator for OPC and process window estimation
Author(s): Bappaditya Dey; Dorin Cerbu; Kasem Khalil; Sandip Halder; Philippe Leray; Sayantan Das; Yasser Sherazi; Magdy A. Bayoumi; Ryoung Han Kim
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