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PROCEEDINGS VOLUME 11325

Metrology, Inspection, and Process Control for Microlithography XXXIV
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Volume Details

Volume Number: 11325
Date Published: 10 April 2020

Table of Contents
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Front Matter: Volume 11325
Author(s): Proceedings of SPIE
Metrology for advanced transistor and memristor devices and materials
Author(s): Alain C. Diebold; Nathaniel C. Cady
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Contour based metrology: “make measurable what is not so"
Author(s): Bertrand Le-Gratiet; Régis Bouyssou; Julien Ducoté; Alain Ostrovsky; Charlotte Beylier; Christian Gardin; Nivea Schuch; Vincent Annezo; Loïc Schneider; Matthieu Millequant; Paolo Petroni; Thiago Figueiro; Patrick Schiavone
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Understanding advanced DRAM edge placement error budget and opportunities for control
Author(s): Jaeseung Jeong; Jinho Lee; Jinsun Kim; Sunyoung Yea; Chan Hwang; Seung Yoon Lee; Jeongjin Lee; Joonsoo Park; Peter Nikolsky; Daniel Park; Antonio Corradi; Hyun-Woo Yu; Sun-Wook Jung; Denis Ovchinnikov; Vadim Timoshkov; Isabel de la Fuente Valentin; Yuxiang Yin; Kaustubh Padhye; Wim Tel; Harm Dillen; Koen Thuijs; Daan Slotboom; Miao Wang; Rhys Su; Marc Kea; Jin-Woo Lee; Yun-A Sung; Sang-Uk Kim; Young-Hoon Song; James Lee; Oh-Sung Kwon
Show Abstract
Real-time full-wafer design-based inter-layer virtual metrology
Author(s): Lianghong Yin; John Sturtevant; Alberto Lopez Gomez; Shumay Shang; Young Chang Kim; Kostas Adam; Marko Chew; Abhinandan Nath; Boris Habets; Manuela Gutsch; Philip Groeger
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Accuracy assessment between on-product and on-optical-target overlay metrology with SEM and STEM
Author(s): Yaniv Abramovitz; Guy Levin; Lior Sarig; Shimon Levi; Ofer Adan; Ashley Tilson; Jason Arjavac; Michael Strauss; Laurens Kwakman; Philippe Leray; Sandip Halder
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Atom probe tomography using extreme-ultraviolet light
Author(s): Luis Miaja-Avila; Ann N. Chiaramonti; Benjamin W. Caplins; David R. Diercks; Brian P. Gorman; Norman A. Sanford
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VIA dishing metrology for novel 3D NAND using neural network assisted white light interferometry
Author(s): Sicong Wang; Xiaoye Ding; Yi Zhou; Yanzhong Ma; Le Yang; Chi Chen; Lu Chen
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High resolution acoustic metrology by combining high GHZ frequency ultrasound and scanning probe microscopy
Author(s): Maarten H. van Es; Benoit A. J. Quesson; Abbas Mohtashami; Daniele Piras; Kodai Hatakeyama; Laurent Fillinger; Paul L.M.J. van Neer
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Inline Part Average Testing (I-PAT) for automotive die reliability
Author(s): John C. Robinson; Kara Sherman; David W. Price; Jay Rathert
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Multi-beam Inspection (MBI) development progress and applications
Author(s): Eric Ma; Weiming Ren; Xinan Luo; Shuo Zhao; Xuerang Hu; Xuedong Liu; Chiyan Kuan; Kevin Chou; Martijn Maassen; Weihua Yin; Aiden Chen; Niladri Sen; Martin Ebert; Lei Liu; Fei Wang; Oliver D. Patterson
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Stochastic model prediction of pattern-failure
Author(s): Sophie (Hyejin) Jin; John Sturtevant; Shumay Shang; Lianghong Yin; Kevin Ahi
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Novel post-lithography macro inspection strategies for advanced legacy fab challenges
Author(s): A. Bordogna; S. Seminato; A. Corno; A. Beccalli; L. Motta; G. Pistone; F. Ferrario; P. Piacentini; B. Micali; P. Sharma; L. Bouckou; P. Parisi; T. Groos
Show Abstract
Massive metrology of 2D logic patterns on BEOL EUVL
Author(s): Sayantan Das; Seulki Kang; Sandip Halder; Kotaro Maruyama; Philippe Leray; Yuichiro Yamazaki
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3D-NAND wafer process monitoring using high voltage SEM with auto e-beam tilt technology
Author(s): Leeming Tu; Jian Mi; Henry Fan; Haydn Zhou; Felix Xiong; Louis Tu; Gangyi Chen; Chuanyu Shao; Long Zhang; Shinji Kubo
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3D analysis of high-aspect ratio features in 3D-NAND
Author(s): Jens Timo Neumann; Dmitry Klochkov; Thomas Korb; Sheetal Gupta; Amir Avishai; Ramani Pichumani; Keumsil Lee; Alex Buxbaum; Eugen Foca
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Accuracy improvement of 3D-profiling for HAR features using deep learning
Author(s): Wei Sun; Pushe Zhao; Yasunori Goto; Takuma Yamamoto; Taku Ninomiya
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Machine learning and hybrid metrology using HV-SEM and optical methods to monitor channel hole tilting in-line for 3D NAND wafer production
Author(s): Michael Meng; Leeming Tu; Jian Mi; Haydn Zhou; Xi Zou
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Comparing edge detection algorithms: their impact on unbiased roughness measurement precision and accuracy
Author(s): Chris A. Mack
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Comparison of SEM and AFM performances for LER reference metrology
Author(s): Ryosuke Kizu; Ichiko Misumi; Akiko Hirai; Satoshi Gonda
Show Abstract
Noise fidelity in SEM simulation
Author(s): Benjamin D. Bunday
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Line top loss and line top roughness characterizations of EUV resists
Author(s): D. Schmidt; K. Petrillo; M. Breton; J. Fullam; S. Hand; J. Osborne; W. Wang; D. Fey
Show Abstract
Characterization of defects in line/space patterns (Conference Presentation)
Author(s): Vassilios Constantoudis; Bradley Williams; Nikolaos Kehagias; George Papavieros; Clivia M. Sotomoyor Torres; Evangelos Gogolides
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White-light Mueller-matrix Fourier scatterometry for the characterization of nanostructures with large parameter spaces
Author(s): M. L. Gödecke; K. Frenner; W. Osten
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X-ray metrology of nanowire/ nanosheet FETs for advanced technology nodes
Author(s): Madhulika Korde; R. Joseph Kline; Daniel F. Sunday; Nick Keller; Subhadeep Kal; Cheryl Alix; Aelan Mosden; Alain C. Diebold
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Nanoscale grating characterization through EUV spectroscopy aided by machine learning techniques
Author(s): Lukas Bahrenberg; Sven Glabisch; Serhiy Danylyuk; Moein Ghafoori; Sophia Schröder; Sascha Brose; Jochen Stollenwerk; Peter Loosen
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Plasma halogenated a-C:H as growth inhibiting layer for ASD of titanium oxide
Author(s): M. Krishtab; J. Hung; R. Koret; I. Turovets; K. Shah; S. Rangarajan; L. Warad; V. Zhang; R. Ameloot; S. Armini
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Understanding the influence of 3D sidewall roughness on observed line-edge roughness in scanning electron microscopy images
Author(s): L. van Kessel; T. Huisman; C. W. Hagen
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Three-dimensional feature characterization by inline Xe plasma FIB: delayering and deep milling implementation
Author(s): Franz Niedermeier; Agnes Fros; Max Böckl; Wolfgang Kipferl; Michaela Braun; Albert Birner; Haim Pearl; Thomas Schubert; Allen Lee
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Immediate observation of embedded structure after top-down delayering by using “Dig and See” technology for GFIS-SIM based accurate overlay metrology (Conference Presentation)
Author(s): Shinichi Matsubara; Hiroyasu Shichi; Tomihiro Hashizume; Masami Ikota
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AFM characterization for Gate-All-Around (GAA) devices
Author(s): Mary Breton; Jennifer Fullam; Dexin Kong; Daniel Schmidt; Andrew Greene; Julien Frougier; Sean Hand; Jason Osborne; Weijie Wang; David Fey
Show Abstract
Accelerating on-device overlay metrology accuracy verification
Author(s): Yaniv Abramovitz; Lior Sarig; Guy Levin; Shimon Levi; Ron Davidescu; Daniel Harel; Ofer Adan; Philippe Leray; Sandip Halder
Show Abstract
A hybrid total measurement uncertainty methodology for dual beam FIB/SEM metrology
Author(s): Ardavan Zandiatashbar; Chester Chien
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EUV scatterometer with multiple orders of high-harmonic generation
Author(s): Y. S. Ku; W. T. Wang; Y. C. Chen; M. C. Chang; C. L. Yeh; C. W. Lo
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Ruthenium direct etch scatterometry solution for self-aligning semi-damascene
Author(s): Sara Paolillo; Alain Moussa; Gayle Murdoch; Frederic Lazzarino; Anne-Laure Charley; Philippe Leray; Joey Hung; Roy Koret; Shay Wolfling; Avron Ger
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Critical-dimension grazing-incidence small angle X-Ray scattering: applications and development (Conference Presentation)
Author(s): Guillaume Freychet; Dinesh Kumar; Isvar A. Cordova; Ron J. Pandolfi; Patrick P. Naulleau; Cheng Wang; Alex Hexemer
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Sensitivity analysis for the detection of pitchwalk in self-aligned quadruple patterning by GISAXS
Author(s): Maren Casfor Zapata; Nando Farchmin; Mika Pflüger; Konstantin Nikolaev; Victor Soltwisch; Sebastian Heidenreich; Christian Laubis; Michael Kolbe; Frank Scholze
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Contrasting conventional and machine learning approaches to optical critical dimension measurements
Author(s): Bryan M. Barnes; Mark-Alexander Henn
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Contact etch process control application for advanced NAND memory structures
Author(s): R. Kris; G. Klebanov; I. Friedler; E. Frishman; S. Duvdevani Bar; J. Geva; V. Mirovoy; N. Teomim; D. Rathore; D. Rogers; J. Chess; B. Watson
Show Abstract
Advanced machine learning eco-system to address HVM optical metrology requirements
Author(s): Padraig Timoney; Roma Luthra; Alex Elia; Haibo Liu; Paul Isbester; Avi Levy; Michael Shifrin; Barak Bringoltz; Eylon Rabinovich; Ariel Broitman; Eitan Rothstein; Ran Yacoby; Ilya Rubinovich; YongHa Kim; Ofer Shlagman; Barak Ben-Nahum; Marina Zolkin; Igor Turovets
Show Abstract
Measuring local CD uniformity in EUV vias with scatterometry and machine learning
Author(s): Dexin Kong; Daniel Schmidt; Jennifer Church; Chi-Chun Liu; Mary Breton; Cody Murray; Eric Miller; Luciana Meli; John Sporre; Nelson Felix; Ishtiaq Ahsan; Aron J. Cepler; Marjorie Cheng; Roy Koret; Igor Turovets
Show Abstract
Taking the multi-wavelength DBO to the next level of accuracy and robustness
Author(s): Jinsun Kim; Jeongijn Lee; Chan Hwang; Seung Yoon Lee; Wooyoung Jung; Joonsoo Park; Kaustuve Bhattacharyya; Arie den Boef; Simon Mathijssen; Marc Noot; Farzad Farhadzadeh; Daniel Park; Kaustubh Padhye; Se-Ra Jeon; Seung-Bin Yang; Won-Jae Jang; Oh-Sung Kwon
Show Abstract
Run to run and model variability of overlay high order process corrections for mean intrafield signatures
Author(s): Benjamin Duclaux; Maxime Gatefait; Olivier Mermet; Jean-Damien Chapon
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Stitched overlay evaluation and improvement for large field applications
Author(s): Michael May; Blandine Minghetti; Jérome Dépré; Yoann Blancquaert; Pui Lam; Céline Lapeyre; Joungchel Lee
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The application of a Rapid Probe Microscope (RPM) for investigating 1D and 2D structures from EUV lithography
Author(s): Andrew D. L. Humphris; Alain Moussa; Mircea Dusa; Anne-Laure Charley; Elis Newham; Jenny Goulden; Lei Feng; Christopher Bevis
Show Abstract
Process context based wafer level grouping control: an advanced overlay process correction designed for DRAM 1z nm node in high volume manufacturing
Author(s): Linmiao Zhang; William Susanto; Katsumasa Takahashi; Albert Chen; Tim Tang; Yi Zou; Chenxi Lin; Simon Hastings; Samee Ur Rehman; Manouk Rijpstra; Alfonso Sun
Show Abstract
On product overlay metrology challenges in advanced nodes
Author(s): Andrei Shchegrov; Philippe Leray; Yuri Paskover; Liran Yerushalmi; Efi Megged; Yoav Grauer; Roel Gronheid
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High-accuracy, high-speed, and smart metrology in the EUV era
Author(s): Zhigang Wang; Kei Sakai; Yasushi Ebizuka; Masumi Shirai; Makoto Suzuki
Show Abstract
EUV photo resist shrink characterization using low landing energy SEM (Conference Presentation)
Author(s): Shimon Levi
Show Abstract
EUV photoresist reference metrology using TEM tomography
Author(s): Mark Biedrzycki; Umesh Adiga; Andrew Barnum; Alain Mousa; Jason Arjavac; Rose Marie Haynes; Anne-Laure Charley; Phillipe Leray; Dmitry Batuk
Show Abstract
Novel on-product focus metrology for EUV enabling direct focus monitoring and control for EUV systems
Author(s): Inbeom Yim; Koshiba Dakeshi; Chan Hwang; Seung Yoon Lee; Jeongjin Lee; Joonsoo Park; Jenny Yueh; Ali Ghavami; Bart Segers; Miguel Garcia Granda; Yutao Gui; Eric Janda; Frank Staals; Se-Hui Lee; Seung-Bin Yang; Yoon-Tae Lee; Se-Ra Jeon; Daniel Park; Ewoud van West; Elliott McNamara
Show Abstract
Using e-Beam inspection and overlay as tool for identifying process weaknesses in semiconductor processing
Author(s): Kwame Owusu-Boahen; Suraj Patil; Arun Vijayakumar; Alex Pate; Carl Han; Jorg Schwitzgebel; Chulwoo Kim; David J. Moreau
Show Abstract
Mitigating gain, effort and cost for EOW overlay control
Author(s): Olivier Mermet; Maxime Gatefait; Didier Dabernat; Florent Dettoni; Benjamin Duclaux; Bertrand Le-Gratiet
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Optical imaging metrology calibration using high voltage scanning electron microscope at after-development inspection for advanced processes
Author(s): N. Gutman; I. Tarshish; R. Gronheid; C. Dror; D. Michelsson; H. Backhauss; L. Levin; V. Levinski; Y. Paskover; L. Yerushalmi; T. Heidrich; S. Czerkas; U. Pohlmann; F. Laske
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High-order field distortion correction using standalone alignment technology with modeling and sampling optimization
Author(s): Takehisa Yahiro; Katsushi Makino; Haruki Saito; Steven Tottewitz; Boris Habets; Patrick Lomtscher; Jiro Hanaue
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Optical overlay measurement accuracy improvement with machine learning
Author(s): Alexander Verner; Hyunsok Kim; Ikhyun Jeong; Seungwoo Koo; Dongjin Lee; Honggoo Lee; Boaz Ophir; Ohad Bachar; Liran Yerushalmi; Sanghuck Jeon; Dongsub Choi; Jeongpyo Lee
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Statistical local CD uniformity with novel SEM noise reduction method
Author(s): Shinji Kobayashi
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On-product focus monitoring and control for immersion lithography in 3D-NAND manufacturing
Author(s): Amine Lakcher; Ahmed Zayed; Jennifer Shumway; Jan-Pieter van Delft; Gratiela Isai; Ruxandra Mustata; Arno van den Brink; Taeddy Kim; Jay Jung; Yong-Sik Shin; Soo-Kyung Lee; Paul Böcker; Mohamed El Kodadi; Geert Vinken; ChanHa Park; Sangjun Han; Jeongsu Park; Beomki Shin; Gunwoong Lee
Show Abstract
A novel accurate and robust technique in after-etch overlay metrology of 3D-NAND’s memory holes
Author(s): Yaobin Feng; Dean Wu; Pandeng Xuan; Pavel Izikson; Payne Qi; Huanian You; Yvon Chai; Jan Jitse Venselaar; Giulio Bottegal; Gonzalo Sanguinetti; Bert Verstraeten; Tjitte Nooitgedagt; Babak Mozooni
Show Abstract
Advanced process control loop for SAQP pitch walk with combined lithography, deposition and etch actuators
Author(s): Huan Ren; Antonio Mani; Sixiao Han; Xin Li; Xuemei Chen; Dieter Van Den Heuvel
Show Abstract
Realizing more accurate OPC models by utilizing SEM contours
Author(s): Chih-I Wei; Rajiv Sejpal; Yunfei Deng; Ir Kusnadi; Germain Fenger; Masahiro Oya; Yosuke Okamoto; Kotaro Maruyama; Yuichiro Yamazaki; Sayantan Das; Sandip Halder; Werner Gillijns
Show Abstract
EB metrology of Ge channel gate-all-around FET: buckling evaluation and EB damage assessment
Author(s): Takeyoshi Ohashi; Kazuhisa Hasumi; Masami Ikota; Gian Lorusso; Liesbeth Witters; Naoto Horiguchi
Show Abstract
Automated semiconductor wafer defect classification dealing with imbalanced data
Author(s): Po-Hsuan Lee; Zhe Wang; Cho Teh; Yi-Sing Hsiao; Wei Fang
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SEM image quality enhancement: an unsupervised deep learning approach
Author(s): Liangjiang Yu; Wentian Zhou; Lingling Pu; Wei Fang
Show Abstract
Massive metrology for process development and monitoring applications
Author(s): Kaushik Sah; Sayantan Das; Shifang Li; Christophe Beral; Andrew Cross; Sandip Halder
Show Abstract
Enabling accurate and robust optical metrology of in device overlay
Author(s): Min-Seok Kang; Chan Hwang; Seungyoon Lee; Jeongjin Lee; Joon-Soo Park; Christian Leewis; Eun-Ji Yang; Do-Haeng Lee; James Lee; Sabil Huda; Noh-Kyoung Park; Anagnostis Tsiatmas; Giulio Bottegal; Amy Wang; Filippo Belletti; Jan Jitse Venselaar; Giacomo Miceli; Izabela Saj; Sam Chen
Show Abstract
Contour extraction algorithm for edge placement error measurement using machine learning
Author(s): Yosuke Okamoto; Shinichi Nakazawa; Akinori Kawamura; Tsugihiko Haga; Taihei Mori; Kotaro Maruyama; Seul-Ki Kang; Yuichiro Yamazaki
Show Abstract
Color filter and numeric aperture selections for image based overlay measurement in critical recording head manufacturing process
Author(s): Gavin Mathias; Yi Liu; Richard Schuster; Aaron Bowser
Show Abstract
Machine learning for Tool Induced Shift (TIS) reduction
Author(s): Shlomit Katz; Boaz Ophir; Udi Shusterman; Anna Golotsvan; Liran Yerushalmi; Efi Megged; Yoav Grauer; Jian Zhang; Alimei Shih; Shi-Ming Wei; Judith Yep; Fiona (Shuk Fan) Leung; Pek Beng Ong
Show Abstract
OPO residuals reduction with imaging metrology color per layer mode
Author(s): Shlomit Katz; Honggoo Lee; Dongyoung Lee; Jinsoo Kim; Jaesun Woo; Chunsoo Kang; Chanha Park; Dohwa Lee; Seongjae Lee; Sanghuck Jeon; Dongsub Choi; Anna Golotsvan; Roie Volkivich; Efi Megged
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A trainable die-to-database for fast e-Beam inspection: learning normal images to detect defects
Author(s): Masanori Ouchi; Masayoshi Ishikawa; Shinichi Shinoda; Yasutaka Toyoda; Ryo Yumiba; Hiroyuki Shindo; Masayuki Izawa
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A strengthen mask r-CNN method for PFA image measurement
Author(s): Tung-Yu Wu; Chun Yen Liao; Chun-Hung Lin; Kao-Tsai Tsai; Jun-Sheng Wu; Chao-Yi Huang
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A novel high throughput probe microscope: for measuring 3D structures, designed for in-line, integrated or standalone operation
Author(s): A.D. L. Humphris; L. Feng; M. Tedaldi; L. Mudarikwa; D. Ockwell; J. Goulden
Show Abstract
OPO residuals improvement with imaging metrology for 3D NAND
Author(s): Shlomit Katz; Anna Golotsvan; Yoav Grauer; Efi Megged; Greg Gray; Fiona (Shuk Fan) Leung; Pek Beng Ong; Shi Lei; Jeremy (Shi-Ming) Wei; Wayne (Wei) Zhou; Linfei Gao
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Photosensitive organic insulator photo-cell monitoring through advanced macro inspection
Author(s): A. Corno; A. Bordogna; M. Braga; A. Pescalli; F. Ferrario; U. Iessi; P. Canestrari; P. Sharma; M. Salamone; P. Parisi; T. Groos
Show Abstract
Enhancing the applications space of diffraction based overlay metrology by increasing throughput and target pitch flexibility
Author(s): Simon Mathijssen; Herman Heijmerikx; Farzad Farhadzadeh; Marc Noot; Lineke van der Sneppen; Longfei Shen; Fei Jia; Jolly Xu; Huajun Qin; Arie den Boef; Elliott Mc Namara; Kaustuve Bhattacharyya; Chao Fang; Yaobin Feng
Show Abstract
Wavelength influence on the determination of subwavelength grating parameters by using optical scatterometry
Author(s): Lauryna Siaudinyte; Silvania F. Pereira
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Nano-scale molecular analysis of positive tone photo-resist films with varying dose
Author(s): Michael J. Eller; Mingqi Li; Xisen Hou; Stanislav V. Verkhoturov; Emile A. Schweikert; Peter Trefonas
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Improved device overlay by litho aberration tracking with novel target design for DRAM
Author(s): Xiaolei Liu; Eitan Hajaj; Alon Volfman; Hedvi Spielberg; Yoav Grauer; Raviv Yohanan; Xindong Gao
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OPO reduction by novel target design
Author(s): Zephyr Liu; Eitan Hajaj; Ira Naot; Raviv Yohanan; Yoav Grauer
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New improving metrology for advanced memory devices with high transmission attenuated phase shift mask
Author(s): Chia-Hung Chen; Sheng-Tsung Tsao; CongCong Fan; Jie Du; Richer Yang; Asei Chou; Kunyuan Chen; Jimmy Chang; JunJun Zhang; Wallace He; Leslie Zhang; YunSheng Xia
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Saving scribe-lane space by using narrow alignment marks
Author(s): Chia-Hung Chen; Sheng-Tsung Tsao; CongCong Fan; Jie Du; Richer Yang; Asei Chou
Show Abstract
High speed roughness measurement on blank silicon wafers using wave front phase imaging
Author(s): J. M. Trujillo-Sevilla; J. M. Rodríguez-Ramos; J. Gaudestad
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Improving after-etch overlay performance using high-density in-device metrology in DRAM manufacturing
Author(s): Ik-Hyun Jeong; Seung-Woo Koo; Hyun-Sok Kim; Jung-Il Hwang; Dong-Jin Lee; Min-Shik Kim; Jae-Wuk Ju; Kang-Min Lee; Young-Sik Kim; Cees Lambregts; Rizvi Rahman; Marc Hauptmann; Raheleh Pishkari; Allwyn Boustheen; Kwang-Young Hu; Paul Böcker; Dong-Hak Lee; In-Ho Joo; Kang-San Lee
Show Abstract
The improvement of measurement accuracy of SADP pitch walking issue
Author(s): Pei Liu; Cheng-Zhang Wu; Hung-Wen Chao; Wenzhan Zhou; Yu Zhang; Chan-Yuan Hu; Yujie Xu; Jhen-Cyuan Li; Yen-Chan Chiu; Chun-Han Liu; Ran-Fu Yang; Chi-Hung Wang
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Metrology of 3D-NAND structures using machine learning assisted fast marching level-sets algorithm
Author(s): Umesh Adiga; Derek Higgins; Sang Hoon Lee; Mark Biedrzycki; Dan Nelson
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High speed, high accuracy displacement extraction from sinusoidal like Moiré fringes in a novel optical encoding technology
Author(s): Zhijian Zhong; Chenyi Li; Shiguang Li; Penghao Li; Qingcheng Ma; Haoyuan Zhao; Jing Zhang; Yayi Wei
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