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35th European Mask and Lithography Conference (EMLC 2019)
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Volume Details

Volume Number: 11177
Date Published: 4 October 2019

Table of Contents
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Front Matter: Volume 11177
Author(s): Proceedings of SPIE
The potential of EUV lithography
Author(s): Harry J. Levinson
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Continuous challenges for next era of lithography
Author(s): Takahiro Hiromatsu; Ryo Ohkubo; Hitoshi Maeda; Toru Fukui; Hiroaki Shishido; Kazunori Ono; Masahiro Hashimoto
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MPC strategies for multi-beam mask writers
Author(s): Ingo Bork; Peter Buck
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Necessity is the mother of invention: support vector machines for CD control
Author(s): Christian Bürgel; Martin Sczyrba; Clemens Utzny
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EUVL is being inserted in manufacturing in 2019: What are the mask related challenges remaining?
Author(s): Kurt Ronse; Rik Jonckheere; Emily Gallagher; Vicky Philipsen; Lieve Van Look; Eric Hendrickx; Ryoung Han Kim
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High-NA EUV lithography: pushing the limits
Author(s): C. Zahlten; P. Gräupner; J. van Schoot; P. Kürz; J. Stoeldraijer; W. Kaiser
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Multi-beam technology for defect inspection of wafer and mask
Author(s): Weiming Ren; Xuedong Liu; Xuerang Hu; Xinan Luo; Xiaoyu Ji; Qingpo Xi; Kevin Chou; Martin Ebert; Eric Ma
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Dual platform stepper/scanner-based overlay evaluation method
Author(s): P. Kulse; S. Jätzlau; K. Schulz; M. Wietstruck
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High-NA EUV imaging: challenges and outlook
Author(s): Bartosz Bilski; Jörg Zimmermann; Matthias Roesch; Jack Liddle; Eelco van Setten; Gerardo Bottiglieri; Jan van Schoot
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Enhanced wafer overlay residuals control: deep sub-nanometer at sub-millimeter lateral resolution
Author(s): Yael Sufrin; Philippe Leray; Eren Canga; Avi Cohen; Vladimir Dmitriev; Kujan Gorhad
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Antireflective moth-eye structures on curved surfaces fabricated by nanoimprint lithography
Author(s): Michael J. Haslinger; Amiya R. Moharana; Michael Mühlberger
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Applying big data technologies to high tech manufacturing
Author(s): Dirk Ortloff; Nils Knoblauch
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Towards a visualization of deep neural networks for rough line images
Author(s): Narendra Chaudhary; Serap A. Savari
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Progress in EUV resists for contact holes printing using EUV interference lithography
Author(s): Xiaolong Wang; Li-Ting Tseng; Iacopo Mochi; Michaela Vockenhuber ; Lidia van Lent-Protasova; Rolf Custers; Gijsbert Rispens; Rik Hoefnagels; Yasin Ekinci
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Lithographic effects due to particles on high-NA EUV mask pellicle
Author(s): Lokesh Devaraj; Gerardo Bottiglieri; Andreas Erdmann; Felix Wählisch; Michiel Kupers; Eelco van Setten; Timon Fliervoet
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Alternative mask materials for low-k1 EUV imaging
Author(s): Frank J. Timmermans; Claire van Lare; Jo Finders
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Progress in imaging performance with EUV pellicles
Author(s): O. Romanets; K. Ricken; M. Kupers; F. Wählisch; C. Piliego; P. Broman; D. de Graaf
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Haze and pellicle material selection for haze free
Author(s): Sang Jin Cho; Byung Pil Lee; Ji Hyang Kim; Won Kyeong Song; Heon Kyu Choi; Gil Su Lee; Sung Wan Kim; Ji Kang Kim
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Reduce probability of wafer intra-field process (printing) defects for logic and DRAM applications
Author(s): Yael Sufrin; Avi Cohen; Ofir Sharoni; Rolf Seltmann
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Influence of the dose assignment and fracturing type on patterns exposed by a variable shaped e-beam writer: simulation vs experiment
Author(s): Varvara Brackmann; Michael Friedrich; Clyde Browning; Norbert Hanisch; Benjamin Uhlig
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Detection and mitigation of furnace anneal induced distortions at the wafer edge
Author(s): Leon van Dijk; Anne-Laure Charley; Maarten Stokhof; Ronald Otten; Sven Van Elshocht; Bert Jongbloed; Philippe Leray; Richard van Haren
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Chrome mask fabrication on Al2O3 substrate for new generation devices based on AlGaN/GaN heterostructure
Author(s): Kornelia Indykiewicz; Bartłomiej Paszkiewicz; Agnieszka Zawadzka; Regina Paszkiewicz
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Antireflective moth-eye structures on curved surfaces fabricated by nanoimprint lithography (Erratum)
Author(s): Michael J. Haslinger; Amiya R. Moharana; Michael Mühlberger
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