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PROCEEDINGS VOLUME 11148 • new

Photomask Technology 2019
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Volume Details

Volume Number: 11148
Date Published: 4 November 2019

Table of Contents
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Front Matter: Volume 11148
Author(s): Proceedings of SPIE
Chip to city: the future of mobility
Author(s): Stefan Jockusch
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2019 Mask makers' survey conducted by the eBeam Initiative
Author(s): Aki Fujimura; Jan Willis
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Creating nonideality: enabling cross-platform process matching solutions with MPC (and a lot of hard work)
Author(s): Charles Whiting; Ingo Bork; Peter Buck; Robin Chia; Bharadwaj Durvasula; Daniel M. Hill; Gazi Huda; Ken Jantzen; Matthew Leuthold; Jianliang Li; Joerg Mellmann; Kushlendra Mishra; Jed Rankin; Nageswara Rao; Malavika Sharma; Rachit Sharma; Adam Smith; Michaela Wentz
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Extending a multi-beam laser writer for optical and EUV masks
Author(s): H. Christopher Hamaker
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Five deep learning recipes for the mask-making industry
Author(s): Ajay Baranwal; Mike Meyer; Thang Nguyen; Suhas Pillai; Noriaki Nakayamada; Mikael Wahlsten; Aki Fujimura; Mariusz Niewczas; Michael Pomerantsev
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Mask modeling using a deep learning approach
Author(s): Alex Zepka; Sabrina Aliyeva; Parikshit Kulkarni; Narendra Chaudhary
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Making digital twins using the Deep Learning Kit (DLK)
Author(s): Linyong Pang; Suhas Pillai; Thang Nguyen; Mike Meyer; Ajay Baranwal; Henry Yu; Mariusz Niewczas; Ryan Pearman; Abhishek Shendre; Aki Fujimura
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Loading effect correction set up by supplementing CD measurement analysis with machine learning
Author(s): Christian Bürgel; Martin Sczyrba; Clemens Utzny
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Requirements of data technology for EUV photomask
Author(s): Jin Choi; Jonggul Doh; Minah Kim; Chan Uk Jeon
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Resist-slope aware modeling for mask process correction applications
Author(s): Rachit Sharma; Ingo Bork; Kushlendra Mishra; ShiZhi Lyu; Linna Cong; Mingjing Tian; Malavika Sharma; Bhardwaj Durvasula; Nageswara Rao; Peter Buck
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MPC simplification for established model-based mask process correction solutions
Author(s): Gek Soon Chua; Weijie Lu; Yee Mei Foong; Weilong Wang; Todd Bailey; Paul Ackmann; Jed Rankin
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Improving chip performance by photomask tuning: ultimate intra-field CD control as a major part of an overall excursion prevention strategy
Author(s): Rolf Seltmann; Aravind Narayana Samy; Thomas Thamm; Ofir Sharoni; Yael Sufrin; Avi Cohen; Thomas Scheruebl
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Patterning, mask life, throughput and overlay improvements for high volume semiconductor manufacturing using nanoimprint lithography
Author(s): Osamu Morimoto; Takehiko Iwanaga; Yukio Takabayashi; Keita Sakai; Wei Zhang; Anshuman Cherala; Se-Hyuk Im; Mario Meissl; Jin Choi
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Novel cleaning technology for nanoparticle removal
Author(s): Mana Tanabe; Kosuke Takai; Kyo Otsubo; Kaori Umezawa; Minako Iinuma; Hideaki Sakurai; Shingo Kanamitsu
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Photoresist development as a reaction-diffusion process (Conference Presentation)
Author(s): Gurdaman Khaira; Yuri Granik
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Machine learning guided curvilinear MPC
Author(s): Malavika Sharma; Bhardwaj Durvasula; Nageswara Rao; Ingo Bork; Rachit Sharma; Kushlendra Mishra; Peter Buck
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Design to silicon flow challenges for silicon photonics (Conference Presentation)
Author(s): Ian Stobert; Karen Badger; Gek Soon Chua; Mohamed Gheith; Matthew Kinzler; Adam Smith
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Adopting curvilinear shapes for production ILT: challenges and opportunities
Author(s): Ryan Pearman; Jeff Ungar; Nagesh Shirali; Abishek Shendre; Mariusz Niewczas; Leo Pang; Aki Fujimura
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Study of mask and wafer co-design that utilizes a new extreme SIMD approach to computing in memory manufacturing: full-chip curvilinear ILT in a day
Author(s): Linyong Pang; Ezequiel Vidal Russell; Bill Baggenstoss; Michael Lee; Jennefir Digaum; Ming-Chuan Yang; P. Jeffrey Ungar; Ali Bouaricha; Kechang Wang; Bo Su; Ryan Pearman; Aki Fujimura
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Examination of flatness key performance indicators for reticles in next-generation, high-NA EUV scanners
Author(s): David L. Aronstein; Christopher Avery; Katherine Ballman; Christopher Lee; John Zimmerman
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Actinic patterned mask defect inspection for EUV lithography
Author(s): Hiroki Miyai; Tsunehito Kohyama; Tomohiro Suzuki; Kiwamu Takehisa; Haruhiko Kusunose
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Capability of DUV inspection for the LWR improved EUV mask of sub-15 nm hp on wafer
Author(s): Masato Naka; Keisuke Chiba; Ai Kumada; Keiko Morishita; Kosuke Takai; Ryoji Yoshikawa; Yukiyasu Arisawa; Takashi Kamo; Eishi Shiobara; Shingo Kanamitsu
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EUV reticle defectivity protection options
Author(s): Michael Lercel; Christophe Smeets; Mark van der Kerkhof; Amo Chen; Tjarko van Empel; Vadim Banine
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CNT EUV pellicle: balancing options (Conference Presentation)
Author(s): Emily E. Gallagher; Ivan Pollentier; Marina Y Timmermans; Marina Mariano Juste; Cedric Huyghebaert
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Investigation of reducing mask writing time with shot count management solution
Author(s): Linna Cong; Shizhi Lyu; Mingjing Tian; Feng Liu; Min Zhang; Zexi Deng; Chunli Zhang; Ming Chen
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Wafer alignment mark placement accuracy impact on the layer-to-layer overlay performance
Author(s): Richard van Haren; Steffen Steinert; Orion Mouraille; Koen D'havé; Leon van Dijk; Jan Hermans; Dirk Beyer
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Lithography printability review: an application on advanced photomask production for enhancing mask yield and cycle time
Author(s): Wenjun Ling; Xuefei Qin; Dejian Li; Fen Xue; Jie Wang; Cong Lu; Mingjing Tian; Ming Chen; Vikram L. Tolani; Gregg A. Inderhees; Alexander Tan; Suo Li; Xiaodi Liu
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A model based OPC method to add serifs for corner rounding design of CMOS image sensor
Author(s): Zengzhi Huang; Lingyun Ni; Koichi Fujii; Xiaolu Huang
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Strategy for the breakthrough of RLS trade-off relationship in the development of novel resist materials and a developer
Author(s): Ayako Nakajima; Manabu Hoshino; Kazunori Taguchi; Takahiro Kozawa
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High temperature baking process study in advanced mask cleaning
Author(s): Dejian Li; Fen Xue; Cong Lu; Wenjun Ling; Xuefei Qin; Jie Wang
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Low reflection phase shift mask for high resolution flat panel displays
Author(s): Narihiro Morosawa; Eiji Shiozaki; Kagehiro Kageyama
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A fast DFM-driven standard cell qualification approach for critical layers of 14nm technology node
Author(s): Xiaojing Su; Rui Chen; Yayi Wei; Yajuan Su; Lisong Dong
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Large dies stitching: a technical and cross-functional teams challenge
Author(s): Philippe Morey-Chaisemartin; Eric Beisser; Frederic Brault; Farid Benzakour
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Exploring alternative EUV mask absorber for iN5 self-aligned block and contact layers
Author(s): Rajiv Sejpal; Vicky Philipsen; Ana Armeanu; Chih-I Wei; Werner Gillijns; Neal Lafferty; Germain Fenger; Eric Hendrickx
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A study of curvilinear routing in IN5 standard cells: challenges and opportunities (Poster Presentation)
Author(s): Amit Dounde; Syed Muhammad Yasser Sherazi; Ryoung-Han R. Kim; Darko Trivkovic; Werner Gillijns; Youssef Drissi
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High throughput AFM inspection system with parallel active cantilevers
Author(s): M. Holz; C. Reuter; A. Reum; A. Ahmad; M. Hofmann; T. Ivanov; I. W. Rangelow; J. Stauffenberg; E. Manske; C. Du; X. Q. Zhou; N. Okamoto; A. N. Takashima; H. S. Lee
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Atomic force microscope integrated into a scanning electron microscope for fabrication and metrology at the nanometer scale
Author(s): Mathias Holz; Christoph Reuter; Alexander Reum; Ahmad Ahmad; Martin Hofmann; Tzvetan Ivanov; Stephan Mechold; Ivo W. Rangelow
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193nm mask inspection challenges and approaches for 7nm/5nm technology and beyond
Author(s): Ariel Shkalim; Paul Crider; Evgeny Bal; Ronen Madmon; Alexander Chereshnya; Oren Cohen; Oded Dassa; Ori Petel; Boaz Cohen
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Practical lithography hotspot identification using mask process model
Author(s): Pai Chi Chen; Chain Ting Huang; Shang Feng Weng; Yung Feng Cheng; Young Ham; Colbert Lu; Michael Green; Mohamed Ramadan; Hong Jen Lee; Chris Progler
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Characterization of quartz etched depth and optical density of opaque pattern for the wafer CD behavior on advanced mask
Author(s): William Chou; Jeffrey Cheng; C. H. Twu; Adder Lee; Chih Hsuan Chao; Xin Ren Yu; Po Tsang Chen; Edgar Huang; Junjin Lin; Sweet Chen; James Cheng; Colbert Lu; Josh Tzeng; Jackie Cheng; Heng Jen Lee; Young Ham
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Evaluation of neighborhood pattern matching algorithm in MPC processing
Author(s): Kohei Yanagisawa; Kota Kobayashi; Kiyoshi Kageyama; Sebastian Munoz; Fabian Saso; Parikshit Kulkarni; John Valadez; Kokoro Kato
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A case study of benefits for the "IOFF" MDP automation project: development, integration, and optimization of the Integrated-Optimized-Fracture-Flow (IOFF) into production
Author(s): Adam Smith; Hari Konnanur
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Development of an EUV and OoB Reflectometer at NewSUBARU synchrotron light facility
Author(s): Keisuke Tsuda; Tetsuo Harada; Takeo Watanabe
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Demonstrating the value of integrated reticle automation solutions in high volume wafer fab manufacturing
Author(s): Frank CM Wu; Chin Kuei Chang; Yousheng Yin; Jeffery Liang; Chain Ping Chen; Wei Chen; Donghwan Song; Jinghua Zeng; Kunal Rohilla; Alexander Tan; Yanghui Liu
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Theory of transformation-invariant compact process modeling
Author(s): Yuri Granik
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