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PROCEEDINGS VOLUME 10810

Photomask Technology 2018
For the purchase of this volume in printed format, please visit Proceedings.com

Volume Details

Volume Number: 10810
Date Published: 21 November 2018

Table of Contents
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Front Matter: Volume 10810
Author(s): Proceedings of SPIE
2018 mask makers’ survey conducted by the eBeam Initiative
Author(s): Aki Fujimura; Jan Willis
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The self-driving photomask
Author(s): J. P. Shiely
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Fracture time predictor in mask data preparation using machine learning
Author(s): Daniel Calderón; Diego Palma
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Deep learning in DFM applications (Conference Presentation)
Author(s): Tetsuaki Matsunawa; Shigeki Nojima
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Minimizing tone reversal during 19x nm mask inspection: PMJ18 Best Paper (Conference Presentation)
Author(s): Masashi Yonetani; Kazunori Seki; Karen D. Badger; Anka Birnstein; Jan Heumann; Takeshi Isogawa; Toshio Konishi; Yutaka Kodera
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WEREWOLF: sensitivity optimization for early 7 nm EUV masks using an optical 19x nm inspection system
Author(s): Karen Badger; Masashi Yonetani; Yusuke Toda; Masayuki Kagawa; Takeshi Isogawa; Jan Heumann
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Ultrashort pulse laser repair of photomasks for advanced lithography technologies
Author(s): Tod Robinson; Jeff LeClaire
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Fast local registration measurements for efficient e-beam writer qualification and correction: EMLC18 Best Paper (Conference Presentation)
Author(s): Klaus-Dieter Roeth; Hendrik Steigerwald; Runyuan Han; Oliver Ache; Frank Laske
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Simulation of fogging electron trajectories in a scanning electron microscope
Author(s): Y. Ito; T. Donga; K. Morimoto; M. Kotera
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Novel EUV mask absorber evaluation in support of next-generation EUV imaging
Author(s): Vicky Philipsen; Kim Vu Luong; Karl Opsomer; Christophe Detavernier; Eric Hendrickx; Andreas Erdmann; Peter Evanschitzky; Robbert W. E. van de Kruijs; Zahra Heidarnia-Fathabad; Frank Scholze; Christian Laubis
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Nanoimprint lithography and a perspective on cost of ownership
Author(s): Douglas J. Resnick; Junji Iwasa
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High volume semiconductor manufacturing using nanoimprint lithography
Author(s): Zenichi Hamaya; Junichi Seki; Toshiya Asano; Keita Sakai; Ali Aghili; Makoto Mizuno; Jin Choi; Chris Jones
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Sub-15nm template fabrication with multi-beam mask writer (Conference Presentation)
Author(s): Koji Ichimura; Koichi Kanno; Masaaki Kurihara; Naoya Hayashi
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Multi-beam – enabling leading-edge mask writing (Conference Presentation) (Withdrawal Notice)
Author(s): Christoph Spengler; Elmar Platzgummer; Hans Loeschner
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Mask process correction validation for multi-beam mask lithography
Author(s): Ingo Bork; Peter Buck; Christian Bürgel; Bhardwaj Durvasula; Stefan Eder-Kapl; Peter Hudek; Michal Jurkovic; Jan Klikovits; Elmar Platzgummer; Jed H. Rankin; Rao Nageswara; Murali Reddy; Christoph Spengler
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Extending mask data preparation to scale to thousands of CPUs and beyond
Author(s): Archana Rajagopalan; Amanda Bowhill; Peter Buck; Bhardwaj Durvasula; Pascal Gilgenkrantz; Stephen Kim; Minyoung Park; Nageswara Rao; Steffen Schulze
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Advanced jog handling techniques in MPC for better QoR
Author(s): Bhardwaj Durvasula; Ingo Bork; Peter Buck; Archana Rajagopalan; Nageswara Rao; Murali Reddy; Steffen Schulze
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Design and implementation of the next generation electron beam resists for the production of EUVL photomasks
Author(s): Scott M. Lewis; Guy A. DeRose; Hayden R. Alty; Matthew S. Hunt; Jarvis Li; Alex Werthiem; Trevor Fowler; Sang Kook Lee; Christopher A. Muryn; Grigore A. Timco; Axel Scherer; Stephen G. Yeates; Richard E. P. Winpenny
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Material design for the improvement of ZEP520A performance
Author(s): A. Nakajima; T. Kozawa; M. Hoshino; M. Hashimoto
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Lithographic benefits and mask manufacturability study of curvilinear masks
Author(s): Vivian Wei Guo; Fan Jiang; Jed Rankin; Ingo Bork; Alexander Tritchkov; Alexander Wei; Yuyang Sun; Srividya Jayaram; Larry Zhuang; Xima Zhang; Todd Bailey; James Word
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Photomask manufacturability and pattern fidelity for curvilinear structures
Author(s): Richard Gladhill; Kent H. Nakagawa
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Advancements in pellicle glue residue removal
Author(s): Davide Dattilo; Sebastian Dietze; Martin Samayoa; Uwe Dietze; Victoria Dahl; Zhenxing Han
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AIMSTM EUV first insertion into the back end of the line of a mask shop: a crucial step enabling EUV production
Author(s): Renzo Capelli; Nathan Wilcox; Martin Dietzel; Dirk Hellweg; Scott Chegwidden; Joseph Rodriguez
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Pattern shift response metrology
Author(s): Kit Ausschnitt; Vincent Truffert; Koen D'Have; Philippe Leray
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E-beam based EUV mask characterization for studying mask induced wafer effects
Author(s): Vidya Vaenkatesan; Qing Tian; Emily Gallagher; Jim Wiley; Jo Finders; Michael Kubis; Jan Mulkens; Chiyan Kuan; Kevin Gao
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AIMS™ EUV tool platform: aerial-image based qualification of EUV masks
Author(s): Renzo Capelli; Martin Dietzel; Dirk Hellweg; Grizelda Kersteen; Ralf Gehrke; Markus Bauer
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A high-brightness accelerator-based EUV source for metrology applications
Author(s): Yasin Ekinci; Terence Garvey; Andreas Streun; Albin Wrulich; Leonid Rivkin
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Experimental evaluation of the impact of EUV pellicles on reticle imaging
Author(s): Iacopo Mochi; Marina Timmermans; Emily Gallagher; Marina Mariano Juste; Ivan Pollentier; Rajendran Rajeev; Patrick Helfenstein; Sara Fernandez; Dimitrios Kazazis; Yasin Ekinci
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Pattern edge roughness study on OMOG mask repair
Author(s): Xuefei Qin; Jie Wang; Irene Shi; Fen Xue; Alan Li; Wenjun Ling; Linna Cong
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Throughput improvement method for cross-sectional profile measurement of hole patterns in nanoimprint templates
Author(s): Kazuki Hagihara; Rikiya Taniguchi; Eiji Yamanaka; Takashi Hirano; Kazuhiko Omote; Yoshiyasu Ito; Kiyoshi Ogata; Naoya Hayashi
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Using 3D Monte Carlo simulation to develop resists for next-generation lithography
Author(s): Hayden R. Alty; Scott M. Lewis; Stephen G. Yeates; Richard E. P. Winpenny
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Intra-field mask-to-mask overlay: separating the mask writing from the dynamic pellicle contribution (PMJ18 Best Poster) (Conference Presentation)
Author(s): Richard J. F. van Haren
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Multiple beam technology development and application for defect inspection on EUV wafer/mask
Author(s): Eric Ma; Kevin Chou; Xuedong Liu; Weiming Ren; Xuerang Hu; Fei Wang
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Improving mask yield by implementing an advanced mask blank inspection system
Author(s): Gregg Inderhees; Bill Kalsbeck; Alexander Tan; Paul Chung; JiUk Hur; Eric Kwon; Min Choo; Wonil Cho; Chan-Uk Jeon; IlYong Jang; In-Yong Kang; JeongHun Seo; Suein Son
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EUV mask and pellicle metrology for high-volume manufacturing (Conference Presentation)
Author(s): Chami Perera; Rupert Perera
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3D NTD resist deformation compact model for OPC and ILT applications
Author(s): Rich Wu; Delian Yang; Folarin Latinwo; Kevin Lucas; Hua Song
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A study of the TMAH based clean performance on advanced photomask
Author(s): Fen Xue; Irene Shi; Alan Li; Eric Tian; Ming Chen; Max Lu; Fei Xu; Wei Jiang; Jian Shen
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Variable shaped beam lithography capabilities enhancement by "small-shots" correction
Author(s): A. Fay; A. Girodon; J. Chartoire; J. Hazart; S. Bayle; P. Schiavone
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2D SRAF rule extraction for fast application based on model-based results
Author(s): Yaoxuan Dai; Xiaojing Su; Pengzheng Gao; Yayi Wei; Yanrong Wang; Jing Zhang; Jiang Yan
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Multiple exposure on single blank for electron-beam writer characterization
Author(s): André Eilert; Michael Finken; Christian Bürgel; Mark Herrmann; Ronald Hellriegel; Rico Nestler; Oliver Löffler; Frank Hübenthal; Rico Büttner; Katja Steidel
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Applying MPC for EUV mask fabrication
Author(s): Dai Tsunoda; Yohei Torigoe; Yutaro Sato; Masakazu Hamaji; Gek-Soon Chua; Christian Bürgel
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Recent bottom layered half-tone mask blanks development for large sized and high resolution flat panel displays
Author(s): Narihiro Morosawa; Yasunori Noguchi; Satoru Mochizuki; Kagehiro Kageyama
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Hotspot analysis and empirical correction through mask and wafer technology harmonization
Author(s): Yohan Choi; William Chou; Jeffrey Cheng; C. H. Twu; Adder Lee; Chih Hsuan Chao; Hsin Fu Chou; Sweet Chen; James Cheng; Colbert Lu; Josh Tzeng; Jackie Cheng; Hong Jen Lee; Michael Green; Mohamed Ramadan; Young Ham; Chris Progler
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Automated rough line-edge estimation from SEM images using deep convolutional neural networks
Author(s): Narendra Chaudhary; Serap A. Savari; S. S. Yeddulapalli
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