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PROCEEDINGS VOLUME 10145

Metrology, Inspection, and Process Control for Microlithography XXXI
Editor(s): Martha I. Sanchez
For the purchase of this volume in printed format, please visit Proceedings.com

Volume Details

Volume Number: 10145
Date Published: 10 May 2017

Table of Contents
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Front Matter: Volume 10145
Author(s): Proceedings of SPIE
Metrology challenges for in-line process control
Author(s): Philippe Leray
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Electrical test prediction using hybrid metrology and machine learning
Author(s): Mary Breton; Robin Chao; Gangadhara Raja Muthinti; Abraham A. de la Peña; Jacques Simon; Aron J. Cepler; Matthew Sendelbach; John Gaudiello; Susan Emans; Michael Shifrin; Yoav Etzioni; Ronen Urenski; Wei Ti Lee
Show Abstract
Patterning control strategies for minimum edge placement error in logic devices
Author(s): Jan Mulkens; Michael Hanna; Bram Slachter; Wim Tel; Michael Kubis; Mark Maslow; Chris Spence; Vadim Timoshkov
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Hybrid scatterometry measurement for BEOL process control
Author(s): Padraig Timoney; Alok Vaid; Byeong Cheol Kang; Haibo Liu; Paul Isbester; Marjorie Cheng; Susan Ng-Emans; Naren Yellai; Matt Sendelbach; Roy Koret; Oram Gedalia
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The coming of age of the first hybrid metrology software platform dedicated to nanotechnologies (Conference Presentation)
Author(s): Johann Foucher; Aurelien Labrosse; Alexandre Dervillé; Yann Zimmermann; Guilhem Bernard; Sergio Martinez; Hanna Grönqvist; Julien Baderot; Florian Pinzan
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A hybrid solution using computational prediction and measured data to accurately determine process corrections with reduced overlay sampling
Author(s): Ben F. Noyes III; Babak Mokaberi; Ram Mandoy; Alex Pate; Ralph Huijgen; Mike McBurney; Owen Chen
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Impact of stochastic process variations on overlay mark fidelity "towards the 5nm node"
Author(s): Michael Adel; Roel Gronheid; Chris Mack; Philippe Leray; Evgeni Gurevich; Bart Baudemprez; Dieter Vandenheuvel; Antonio Mani; Sharon Aharon; Dana Klein; Jungtae Lee; Mark D. Smith
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A complete methodology towards accuracy and lot-to-lot robustness in on-product overlay metrology using flexible wavelength selection
Author(s): Kaustuve Bhattacharyya; Arie den Boef; Marc Noot; Omer Adam; Grzegorz Grzela; Andreas Fuchs; Martin Jak; Sax Liao; Ken Chang; Vincent Couraudon; Eason Su; Wilson Tzeng; Cathy Wang; Christophe Fouquet; Guo-Tsai Huang; Kai-Hsiung Chen; Y. C. Wang; Kevin Cheng; Chih-Ming Ke; L. G. Terng
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Reaching for the true overlay in advanced nodes
Author(s): Chiew-seng Koay; Bassem Hamieh; Nelson Felix; John Gaudiello
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Image based overlay measurement improvements of 28nm FD-SOI CMOS front-end critical steps
Author(s): F. Dettoni; T. Shapoval; R. Bouyssou; T. Itzkovich; R. Haupt; C. Dezauzier
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High-volume manufacturing device overlay process control
Author(s): Honggoo Lee; Sangjun Han; Jaeson Woo; DongYoung Lee; ChangRock Song; Hoyoung Heo; Irina Brinster; DongSub Choi; John C. Robinson
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In-depth analysis of indirect overlay method and applying in production environment
Author(s): Detlef Hofmann; Frank Rabe; Stefan Buhl; Wan-Soo Kim; Boris Habets
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Metrology capabilities and needs for 7nm and 5nm logic nodes
Author(s): Benjamin Bunday; Eric Solecky; Alok Vaid; A. F. Bello; Xintuo Dai
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Variability study with CD-SEM metrology for STT-MRAM: correlation analysis between physical dimensions and electrical property of the memory element
Author(s): Takeyoshi Ohashi; Atsuko Yamaguchi; Kazuhisa Hasumi; Osamu Inoue; Masami Ikota; Gian Lorusso; Gabriele Luca Donadio; Farrukh Yasin; Siddharth Rao; Gouri Sankar Kar
Show Abstract
Designed tools for analysis of lithography patterns and nanostructures
Author(s): Alexandre Dervillé; Julien Baderot; Guilhem Bernard; Johann Foucher; Hanna Grönqvist; Aurélien Labrosse; Sergio Martinez; Yann Zimmermann
Show Abstract
Required metrology and inspection for nanoimprint lithography
Author(s): Masafumi Asano; Hideaki Abe; Kazuto Matsuki; Ryoji Yoshikawa; Motofumi Komori; Takashi Hirano; Shinji Mikami; Yongho Kim; Eunhyuk Choi; Woo-Yung Jung
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High-throughput electrical characterization for robust overlay lithography control
Author(s): Devender Devender; Xumin Shen; Mark Duggan; Sunil Singh; Jonathan Rullan; Jae Choo; Sohan Mehta; Teck Jung Tang; Sean Reidy; Jonathan Holt; Hyung Woo Kim; Robert Fox; D. K. Sohn
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Sub-wavelength transmission and reflection mode tabletop imaging with 13nm illumination via ptychography CDI
Author(s): Michael Tanksalvala; Christina L. Porter; Dennis F. Gardner Jr.; Michael Gerrity; Giulia F. Mancini; Xiaoshi Zhang; Galen P. Miley; Elisabeth R. Shanblatt; Benjamin R. Galloway; Charles S. Bevis; Robert Karl Jr.; Daniel A. Adams; Henry C. Kapteyn; Margaret M. Murnane
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Application of actinic mask review system for the preparation of HVM EUV lithography with defect free mask
Author(s): Jihoon Na; Donggun Lee; Changhwan Do; Hong-seok Sim; Jung-Hwan Lee; Jungyoup Kim; Hwan-Seok Seo; Heebom Kim; Chan Uk Jeon
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Towards a stand-alone high-throughput EUV actinic photomask inspection tool: RESCAN
Author(s): Rajeev Rajendran; Iacopo Mochi; Patrick Helfenstein; Istvan Mohacsi; Sophie Redford; Aldo Mozzanica; Bernd Schmitt; Shushuke Yoshitake; Yasin Ekinci
Show Abstract
Patterned wafer geometry grouping for improved overlay control
Author(s): Honggoo Lee; Sangjun Han; Jaeson Woo; Junbeom Park; Changrock Song; Fatima Anis; Pradeep Vukkadala; Sanghuck Jeon; DongSub Choi; Kevin Huang; Hoyoung Heo; Mark D. Smith; John C. Robinson
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Wafer-shape metrics based foundry lithography
Author(s): Sungtae Kim; Frida Liang; Jeffrey Mileham; Damon Tsai; Eric Bouche; Sean Lee; Albert Huang; C. F. Hua; Ming Sheng Wei
Show Abstract
Topography based wafer clustering for wafer level overlay correction
Author(s): Hongoo Lee; Sangjun Han; Heongsoo Kim; Boris Habets; Enrico Bellmann; Steven Tottewitz; Stefan Buhl; Martin Rößiger; Seop Kim
Show Abstract
In-line E-beam metrology and defect inspection: industry reflections, hybrid E-beam opportunities, recommendations and predictions
Author(s): Eric Solecky; Allen Rasafar; Jason Cantone; Benjamin Bunday; Alok Vaid; Oliver Patterson; Andrew Stamper; Kevin Wu; Ralf Buengener; Weihao Weng; Xintuo Dai
Show Abstract
Smart sampling for process control
Author(s): Jeffrey Weintraub; Scott Warrick
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A new method for wafer quality monitoring using semiconductor process big data
Author(s): Younghoon Sohn; Hyun Lee; Yusin Yang; Chungsam Jun
Show Abstract
Combined process window monitoring for critical features
Author(s): Carsten Hartig; Bernd Schulz; Robert Melzer; Matthias Ruhm; Daniel Fischer; Stefan Buhl; Boris Habets; Martin Rößiger; Manuela Gutsch
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Computational overlay metrology with adaptive data analytics
Author(s): Emil Schmitt-Weaver; Venky Subramony; Zakir Ullah; Masazumi Matsunobu; Ravin Somasundaram; Joel Thomas; Linmiao Zhang; Klaus Thul; Kaustuve Bhattacharyya; Ronald Goossens; Cees Lambregts; Wim Tel; Chris de Ruiter
Show Abstract
Surface topography analysis and performance on post-CMP images (Conference Presentation)
Author(s): Jusang Lee; Abner F. Bello; Shinichiro Kakita; Nicholas Pieniazek; Timothy A. Johnson
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Advanced in-production hotspot prediction and monitoring with micro-topography
Author(s): P. Fanton; T. Hasan; A. Lakcher; B. Le-Gratiet; C. Prentice; J.-G. Simiz; R. La Greca; L. Depre; S. Hunsche
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Global minimization line-edge roughness analysis of top down SEM images
Author(s): Barton Lane; Chris Mack; Nasim Eibagi; Peter Ventzek
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Level crossing methodology applied to line-edge roughness characterization
Author(s): Chris A. Mack; Timothy A. Brunner; Xuemei Chen; Lei Sun
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Multitaper and multisegment spectral estimation of line-edge roughness
Author(s): Yao Luo; Serap A. Savari
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An OCD perspective of line edge and line width roughness metrology
Author(s): Ravi Bonam; Raja Muthinti; Mary Breton; Chi-Chun Liu; Stuart Sieg; Indira Seshadri; Nicole Saulnier; Jeffrey Shearer; Raghuveer Patlolla; Huai Huang
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Enabling CD SEM metrology for 5nm technology node and beyond
Author(s): Gian Francesco Lorusso; Takeyoshi Ohashi; Astuko Yamaguchi; Osamu Inoue; Takumichi Sutani; Naoto Horiguchi; Jürgen Bömmels; Christopher J. Wilson; Basoene Briggs; Chi Lim Tan; Tom Raymaekers; Romain Delhougne; Geert Van den Bosch; Luca Di Piazza; Gouri Sankar Kar; Arnaud Furnémont; Andrea Fantini; Gabriele Luca Donadio; Laurent Souriau; Davide Crotti; Farrukh Yasin; Raf Appeltans; Siddharth Rao; Danilo De Simone; Paulina Rincon Delgadillo; Philippe Leray; Anne-Laure Charley; Daisy Zhou; Anabela Veloso; Nadine Collaert; Kazuhisa Hasumi; Shunsuke Koshihara; Masami Ikota; Yutaka Okagawa; Toru Ishimoto
Show Abstract
Framework for SEM contour analysis
Author(s): L. Schneider; V. Farys; E. Serret; C. Fenouillet-Beranger
Show Abstract
Robust 2D patterns process variability assessment using CD-SEM contour extraction offline metrology
Author(s): Amine Lakcher; Bertrand Le-Gratiet; Julien Ducoté; Pierre Fanton; Ton Kiers; Jan-Willem Gemmink; Stefan Hunsche; Christopher Prentice; Maxime Besacier
Show Abstract
CD-SEM distortion quantification for EPE metrology and contour analysis
Author(s): Harm Dillen; Ton Kiers; Sandip Halder; Thomas I. Wallow; Frieda van Roey
Show Abstract
Assessing the wavelength extensibility of optical patterned defect inspection
Author(s): Bryan M. Barnes; Hui Zhou; Mark-Alexander Henn; Martin Y. Sohn; Richard M. Silver
Show Abstract
Anamorphic approach for developing hi-efficiency illumination system to inspect defects on semiconductor wafers
Author(s): Woojun Han; Sunseok Yang; Ohhyung Kwon; Seungyong Chu; Seungchul Oh; Woosung Jung; Jaisoon Kim
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1.5nm fabrication of test patterns for characterization of metrological systems
Author(s): S. Babin; N. Bouet; S. Cabrini; G. Calafiore; R. Conley Jr.; G. Gevorkyan; K. Munechika; A. Vladár; V. V. Yashchuk
Show Abstract
Fabrication of metrology test structures with helium ion beam direct write
Author(s): Chien-Lin Lee; Sheng-Wei Chien; Sheng-Yung Chen; Chun-Hung Liu; Kuen-Yu Tsai; Jia-Han Li; Bor-Yuan Shew; Chit-Sung Hong; Chao-Te Lee
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3D-profile measurement of advanced semiconductor features by using FIB as reference metrology
Author(s): Kiyoshi Takamasu; Yuuki Iwaki; Satoru Takahashi; Hiroki Kawada; Masami Ikota
Show Abstract
High-NA optical CD metrology on small in-cell targets enabling improved higher order dose control and process control for logic
Author(s): Hugo Cramer; Elliott Mc Namara; Rik van Laarhoven; Ram Jaganatharaja; Isabel de la Fuente; Sharon Hsu; Filippo Belletti; Milos Popadic; Ward Tu; Wade Huang
Show Abstract
Complex metrology on 3D structures using multi-channel OCD
Author(s): Taher Kagalwala; Sridhar Mahendrakar; Alok Vaid; Paul K. Isbester; Aron Cepler; Charles Kang; Naren Yellai; Matthew Sendelbach; Mihael Ko; Ovadia Ilgayev; Yinon Katz; Lilach Tamam; Ilya Osherov
Show Abstract
Optical metrology strategies for inline 7nm CMOS logic product control
Author(s): Michael Lenahan; Sridhar Mahendrakar; Alok Vaid; Taher Kagalwala; Kartik Venkataraman; Dawei Hu; Ming Di; Da Song; Janay Camp; Zhou Ren; Nam Hee Yoon
Show Abstract
Evaluating the effects of modeling errors for isolated finite 3D targets
Author(s): Mark-Alexander Henn; Bryan M. Barnes; Hui Zhou
Show Abstract
Scatterometry control for multiple electron beam lithography
Author(s): Yoann Blancquaert; Nivea Figueiro; Thibault Labbaye; Francisco Sanchez; Stephane Heraud; Roy Koret; Matthew Sendelbach; Ralf Michel; Shay Wolfling; Stephane Rey; Laurent Pain
Show Abstract
Advanced optical modeling of TiN metal hard mask for scatterometric critical dimension metrology
Author(s): Peter Ebersbach; Adam M. Urbanowicz; Dmitriy Likhachev; Carsten Hartig
Show Abstract
Advanced applications of scatterometry based optical metrology
Author(s): Dhairya Dixit; Nick Keller; Taher Kagalwala; Fiona Recchia; Yevgeny Lifshitz; Alexander Elia; Vinit Todi; Jody Fronheiser; Alok Vaid
Show Abstract
SEM image prediction based on modeling of electron-solid interaction
Author(s): Toshimasa Kameda; Satoshi Takada; Makoto Suzuki; Toshiyuki Yokosuka; Sergey Borisov; Sergey Babin
Show Abstract
SEM-based overlay measurement between via patterns and buried M1 patterns using high-voltage SEM
Author(s): Kazuhisa Hasumi; Osamu Inoue; Yutaka Okagawa; Chuanyu Shao; Philippe Leray; Sandip Halder; Gian Lorusso; Christiane Jehoul
Show Abstract
High-precision CD measurement using energy-filtering SEM techniques
Author(s): Daisuke Bizen; Makoto Sakakibara; Makoto Suzuki; Yoshinori Momonoi; Hajime Kawano
Show Abstract
SEM imaging capability for advanced nano-structures and its application to metrology
Author(s): Makoto Suzuki; Uki Ikeda; Yuji Kasai; Yuzuru Mizuhara; Takanori Kishimoto; Ichiro Tachibana; Naomasa Suzuki; Hajime Kawano
Show Abstract
3D SEM characterization of advanced sidewall patterning process (Conference Presentation)
Author(s): Shimon Levi
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Pattern centric design based sensitive patterns and process monitor in manufacturing
Author(s): Chingyun Hsiang; Guojie Cheng; Kechih Wu
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The use of computational inspection to identify process window limiting hotspots and predict sub-15nm defects with high capture rate
Author(s): Boo-Hyun Ham; Il-Hwan Kim; Sung-Sik Park; Sun-Young Yeo; Sang-Jin Kim; Dong-Woon Park; Joon-Soo Park; Chang-Hoon Ryu; Bo-Kyeong Son; Kyung-Bae Hwang; Jae-Min Shin; Jangho Shin; Ki-Yeop Park; Sean Park; Lei Liu; Ming-Chun Tien; Angelique Nachtwein; Marinus Jochemsen; Philip Yan; Vincent Hu; Christopher Jones
Show Abstract
CD-SEM metrology and OPC modeling for 2D patterning in advanced technology nodes (Conference Presentation)
Author(s): Thomas I. Wallow; Chen Zhang; Anita Fumar-Pici; Jun Chen; Bart Laenens; Christopher A. Spence; David Rio; Paul van Adrichem; Harm Dillen; Jing Wang; Peng-Cheng Yang; Werner Gillijns; Patrick Jaenen; Frieda van Roey; Jeroen van de Kerkhove; Sergey Babin
Show Abstract
Using the analytical linescan model for SEM metrology
Author(s): Chris A. Mack; Benjamin D. Bunday
Show Abstract
High-throughput multi-beam SEM: quantitative analysis of imaging capabilities at IMEC-N10 logic node
Author(s): J. T. Neumann; T. Garbowski; W. Högele; T. Korb; S. Halder; P. Leray; R. Garreis; M. le Maire; D. Zeidler
Show Abstract
SEM review color imaging detection of gate to source/drain short in 14nm finFET device (Conference Presentation)
Author(s): Kwame Owusu-Boahen; JaeHun Park; HyeJung Lee
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Materials characterization for process integration of multi-channel gate all around (GAA) devices
Author(s): Gangadhara Raja Muthinti; Nicolas Loubet; Robin Chao; Abraham A. de la Peña; Juntao Li; Michael A. Guillorn; Tenko Yamashita; Sivananda Kanakasabapathy; John Gaudiello; Aron J. Cepler; Matthew Sendelbach; Susan Emans; Shay Wolfling; Avron Ger; Daniel Kandel; Roy Koret; Wei Ti Lee; Peter Gin; Kevin Matney; Matthew Wormington
Show Abstract
Molecular dynamics and dynamic Monte-Carlo simulation of irradiation damage with focused ion beams
Author(s): Kaoru Ohya
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"Non-destructive" dimensional metrology of EUV resist gratings (Conference Presentation)
Author(s): R. Joseph Kline; Daniel F. Sunday; Donald Windover; Tero S. Kulmala; Yasin Ekinci
Show Abstract
Application of advanced hybrid metrology method to nanoimprint lithography
Author(s): Ilya Osherov; Limor Issacharoff; Oram Gedalia; Koichi Wakamoto; Matthew Sendelbach; Masafumi Asano
Show Abstract
Connected component analysis of review-SEM images for sub-10nm node process verification
Author(s): Sandip Halder; Philippe Leray; Kaushik Sah; Andrew Cross; Paolo Parisi
Show Abstract
Overlay degradation induced by film stress
Author(s): Chi-hao Huang; Yu-Lin Liu; Shing-Ann Luo; Mars Yang; Elvis Yang; Yung-Tai Hung; Tuung Luoh; T. H. Yang; K. C. Chen
Show Abstract
Scanning electron microscope automatic defect classification of process induced defects
Author(s): Scott Wolfe; Steve McGarvey
Show Abstract
Process resilient overlay target designs for advanced memory manufacture
Author(s): Joonseuk Lee; Mirim Jung; Honggoo Lee; Youngsik Kim; Sangjun Han; Michael E. Adel; Tal Itzkovich; Vladimir Levinski; Victoria Naipak; Anna Golotsvan; Amnon Manassen; Yuri Paskover; Tom Leviant; Efi Megged; Myungjun Lee; Mark D. Smith; Do-Hwa Lee; DongSub Choi; Zephyr Liu
Show Abstract
Asymmetry overlay correction for lithography processes
Author(s): Ming-Jui Chen; Chun-Chi Yu; Tang Chun Weng; C.-H. Chang; Charlie Chen; Chia Ching Lin; En Chuan Lio; Chia Hsiang Yu
Show Abstract
Hybrid methodology for on-product focus control using CD and diffraction-based focus marks
Author(s): Ben F. Noyes III; Alex Pate; Steve Zhou; Marco J. A. van der Heijden; Kevin Park; Reza Sadat Gousheh; Ralph T. Huijgen; Michael S. McBurney; Francois van Loon
Show Abstract
Monitoring of 450mm copper seeding and plating process via dark field inspection haze
Author(s): Nithin Yathapu; Milo Tallon; Justin Brown
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Application of advanced diffraction based optical metrology overlay capabilities for high-volume manufacturing
Author(s): Kai-Hsiung Chen; Guo-Tsai Huang; Hung-Chih Hsieh; Wei-Feng Ni; S. M. Chuang; T. K. Chuang; Chih-Ming Ke; Jacky Huang; Shiuan-An Rao; Aysegul Cumurcu Gysen; Maxime d'Alfonso; Jenny Yueh; Pavel Izikson; Aileen Soco; Jon Wu; Tjitte Nooitgedagt; Jeroen Ottens; Yong Ho Kim; Martin Ebert
Show Abstract
EPE analysis of sub-N10 BEoL flow with and without fully self-aligned via using Coventor SEMulator3D
Author(s): Joern-Holger Franke; Matt Gallagher; Gayle Murdoch; Sandip Halder; Aurelie Juncker; William Clark
Show Abstract
Enhanced 28nm FD-SOI diffraction based overlay metrology based on holistic metrology qualification
Author(s): Florent Dettoni; Régis Bouyssou; Christophe Dezauzier; Jerome Depre; Steffen Meyer; Christopher Prentice
Show Abstract
New alignment mark design structures for higher diffraction order wafer quality enhancement
Author(s): Libin Zhang; Yaobin Feng; Lisong Dong; Xiaojing Su; Zhengguo Tian; Chao Fang; Yayi Wei; Tianchun Ye
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High throughput and dense sampling metrology for process control
Author(s): Lei Sun; Tsunehito Kohyama; Kuniaki Takeda; Hiroto Nozawa; Yuji Asakawa; Taher Kagalwala; Granger Lobb; Frank Mont; Xintuo Dai; Shyam Pal; Wenhui Wang; Jongwook Kye; Francis Goodwin
Show Abstract
Efficient hybrid metrology for focus, CD, and overlay
Author(s): W. T. Tel; B. Segers; R. Anunciado; Y. Zhang; P. Wong; T. Hasan; C. Prentice
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Reducing the overlay metrology sensitivity to perturbations of the measurement stack
Author(s): Yue Zhou; DeNeil Park; Karsten Gutjahr; Abhishek Gottipati; Tam Vuong; Sung Yong Bae; Nicholas Stokes; Aiqin Jiang; Po Ya Hsu; Mark O'Mahony; Andrea Donini; Bart Visser; Chris de Ruiter; Grzegorz Grzela; Hans van der Laan; Martin Jak; Pavel Izikson; Stephen Morgan
Show Abstract
Lab- and field-test results of MFIG, the first real-time vacuum-contamination sensor
Author(s): Diederik Maas; Pim Muilwijk; Michel van Putten; Frank de Graaf; Olaf Kievit; Patrique Boerboom; Norbert B. Koster
Show Abstract
CD uniformity control for thick resist process
Author(s): Chi-hao Huang; Yu-Lin Liu; Weihung Wang; Mars Yang; Elvis Yang; T. H. Yang; K. C. Chen
Show Abstract
Enhanced methodology of focus control and monitoring on scanner tool
Author(s): Yen-Jen Chen; Young Ki Kim; Xueli Hao; Juan-Manuel Gomez; Ye Tian; Ferhad Kamalizadeh; Justin K. Hanson
Show Abstract
Wafer-shape based in-plane distortion predictions using superfast 4G metrology
Author(s): Leon van Dijk; Jeffrey Mileham; Ilja Malakhovsky; David Laidler; Harold Dekkers; Sven Van Elshocht; Doug Anberg; David M. Owen; Richard van Haren
Show Abstract
Monitoring of multi-patterning processes in production environment
Author(s): Sangjun Han; Honggoo Lee; Jaesun Woo; Seungyoung Kim; Wan-Soo Kim; Stefan Buhl; Boris Habets; Seop Kim
Show Abstract
Improved multi-beam laser interference lithography system by vibration analysis model
Author(s): Te Hsun Lin; Yin-Kuang Yang; Hsuan-Ying Mai; Chien-Chung Fu
Show Abstract
A pattern-based method to automate mask inspection files
Author(s): Ezni Aznida Binti Kamal Baharin; Mohamad Fahmi Bin Muhsain; Muhamad Asraf Bin Ahmad Ibrahim; Ahmad Nurul Ihsan Bin Ahmad Noorhani; Jason Sweis; Ya-Chieh Lai; Philippe Hurat
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SAQP pitch walk metrology using single target metrology
Author(s): Fang Fang; Pedro Herrera; Taher Kagalwala; Janay Camp; Alok Vaid; Stilian Pandev; Franz Zach
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Projection lens testing with Moiré effect
Author(s): M. Loktev; Y. Shao
Show Abstract
Precise design-based defect characterization and root cause analysis
Author(s): Qian Xie; Panneerselvam Venkatachalam; Julie Lee; Zhijin Chen; Khurram Zafar
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