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Integrated Circuit Metrology I
Editor(s): Diana Nyyssonen

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Volume Details

Volume Number: 0342
Date Published: 15 October 1982

Table of Contents
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Photomask Iinewidth Measurement Correlation Techniques Using The Standard Reference Material (SRM) 474 National Bureau Of Standards (NBS) Linewidth Standard
Author(s): F. Caprari
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Making Of Secondary Standards From National Bureau Of Standards (NBS) Photomask Standard
Author(s): ManLung Auyeung
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Use Of The National Bureau Of Standards (NBS) Antireflective (AR)-Chromium Optical Linewidth Standard For Measurements On Other Types Of Chromium Photomasks
Author(s): John M. Jerke; Charles E. Wendell
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Design Of An Optical Linewidth Standard Reference Material For Wafers
Author(s): Diana Nyyssonen
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Automatic Detection And Quantification Of Contaminants On Reticles For Semiconductor Microlithography
Author(s): George Quackenbos; Sergey Broude; Eric Chase
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Inspection In The Third Dimension: Metal Mask Inspection Problems
Author(s): Joseph E. Levine; Donald A. MacKinnon
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Improving Registration In Photolithography
Author(s): H. R. Rottmann
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Method Of Characterizing Wafer Steppers
Author(s): Chris Van Peski
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Overlay Characterization Of Projection Aligners Using Electrical Probe Techniques
Author(s): C. P. Ausschnitt; T. A. Brunner; S. C. Yang
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Electrical Test Methods For Evaluating Lithographic Processes And Equipment
Author(s): Dwight Yen
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Monitoring Wafer Stepper Performance With Electrical Test Structures
Author(s): M. A. Mitchell; V. Nagaswami
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Temperature and Chemical Vapor Deposition (CVD) film effects on wafer flatness
Author(s): Peter Gise
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Comparison Of Optical And Mechanical Methods Of Thickness Measurement
Author(s): Albert Feldman; Theodore Vorburger
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Thickness And Refractive Index Measurements By Light Coupling: Design Guidelines Of A Prism Coupler
Author(s): Dilip K. Paul
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Double Film Thickness Measurements In The Semiconductor Industry
Author(s): Richard F. Spanier
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Ellipsometric Accuracy And The Principal Angle Of Incidence
Author(s): Deane Chandler-Horowitz
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