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Optical Microlithography I: Technology for the Mid-1980s
Editor(s): Harry L. Stover

*This item is only available on the SPIE Digital Library.

Volume Details

Volume Number: 0334
Date Published: 13 September 1982

Table of Contents
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Variable Magnification In A 1:1 Projection Lithography System
Author(s): James J. Greed Jr.; David A. Markle
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Pattern Recognition Automatic Fine Alignment
Author(s): D. H. Berry
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Application Of Wafer Probe Techniques To The Evaluation Of Projection Printers
Author(s): C. P. Ausschnitt; T. A. Brunner; S. C. Yang
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Registration Accuracy In Several Versions Of A Scanning 1:1 Optical Projection System
Author(s): Rene Vervoordeldonk; Peter Willemse; Roel Kramer; Tony Cowburn
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Spectral Exposure Meter
Author(s): Nathan Gold
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Proximity Effects And Influences Of Nonuniform Illumination In Projection Lithography
Author(s): P. D. Robertson; F. W. Wise; A. N. Nasr; A. R. Neureuther; C. H. Ting
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Characterization Of The Ultratech Wafer Stepper
Author(s): Ron Hershel; Ron Voison
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Yield Improvement With Pellicalised Masks In Projection Printing Technology
Author(s): A. Rangappan; Chuck Kao
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Near-Term Case For 5x Versus 10x Wafer Steppers
Author(s): Harry L. Stover
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Comparison Of Autoalign Techniques
Author(s): Bruce Heflinger
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Analysis Of Image Field Placement Deviations Of A 5x Microlithographic Reduction Lens
Author(s): Don MacMillen; W. D. Ryden
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EUROSTEP 2000: New Steps In Wafer Steppers
Author(s): Paul Tigreat
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Philips Wafer Stepper: Characterization And Processing Experience
Author(s): Roel Kramer; Rene Vervoordeldonk; Stefan Wittekoek; Rene Beem; Guido van der Looij
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Wafer Stepper Characterization And Process Control Techniques
Author(s): S. C. Curry; C. B. Friedberg
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Automated Wafer Stepping For Very Large Scale Integrated (VLSI) Fabrication
Author(s): D. Leebrick; M. A. Hockey; K. Cummings; J. Greeneich
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Mix And Match Of 10:1 Wafer Steppers With Die-By-Die Alignment To 1:1 Proximity And Projection Systems
Author(s): H. L. Stover; N. E. David; T. H. Lewis
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Mix And Match-10x Reduction Wafer Steppers
Author(s): Adonis Stephanakis; Harry L. Coleman
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Characterization Data And Cross Matching Of A High Performance Step-And-Repeat Aligner
Author(s): Herbert E. Mayer; Ernst W. Loebach
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Hybrid Lithography: Mixing Of 10:1 And 1:1 Projection Aligners
Author(s): Jerris H. Peavey; Stephen Cosentino; Charles Hamner
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User Requirements In Plasma Etch Equipment
Author(s): John M. Salzer
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Faithful Pattern Transfer: What Are The Limits In Production?
Author(s): Richard L. Bersin; Barry Gelernt
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Reactive Sputter Etching And Its Applications
Author(s): Sasson Somekh
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Resist Characterization: Procedures, Parameters, And Profiles
Author(s): M. Exterkamp; W. Wong; H. Damar; A. R. Neureuther; C. H. Ting; W. G. Oldham
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New High Speed Positive Resist For Wafer Steppers
Author(s): R. F. Leonard; W. F. Cordes III
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Characterization Of The Induction Effect At Mid-Ultraviolet Exposure: Application To AZ2400 At 313 Nm
Author(s): Donald C. Hofer; C. Grant Willson; Andrew R. Neureuther; Mark Hakey
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Reticle Inspection Technology To Compare The Pattern Against Data
Author(s): Daikichi Awamura
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Automatic Mask And Reticle Inspection System
Author(s): Hal Yang
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Electron Beam Versus Optical Step-And-Repeat: A 10X Reticle And 1X Die Distortion Study Employing Nikon X-Y Laser Interferometric Metrology
Author(s): Steven K. Dunbrack; Gary Burns
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Detecting Submicron Pattern Defects On Optical Photomasks Using An Enhanced El-3 Electron-Beam Lithography Tool
Author(s): R. A. Simpson; D. E. Davis
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New Deep Ultraviolet Source For Microlithography
Author(s): Michael G. Ury; John C. Matthews; Charles H. Wood
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Checking Of The Thickness Uniformity Of Thin-Film Layers In Semiconductor Devices By Laser Ellipso-Interferometry
Author(s): Teruhita Mishima; Kwan C. Kao
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Linewidth Vernier (LWV)
Author(s): B. J. Lin
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Ultrafast High Resolution Contact Lithography Using Excimer Lasers
Author(s): K. Jain; C. G. Willson; B. J. Lin
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