Share Email Print

Proceedings Paper

Compact 3D wafer packaging using waveguide holographic optical elements
Author(s): Cong T. Nguyen; Freddie Shing-Hong Lin; Michael R. Wang
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

A waveguide holographic optical interconnect technique is used for signal distribution operations in a compact 3D wafer packaging configuration. This paper describes the design, fabrication and results of an integrated optical device which utilizes this waveguide holographic optical interconnect technique.

Paper Details

Date Published: 2 February 1993
Proc. SPIE 1773, Photonics for Computers, Neural Networks, and Memories, (2 February 1993); doi: 10.1117/12.983215
Show Author Affiliations
Cong T. Nguyen, Physical Optics Corp. (United States)
Freddie Shing-Hong Lin, Physical Optics Corp. (United States)
Michael R. Wang, Physical Optics Corp. (United States)

Published in SPIE Proceedings Vol. 1773:
Photonics for Computers, Neural Networks, and Memories
Stephen T. Kowel; John A. Neff; William J. Miceli, Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?