A new design of water cooled heat sink with micro-channels and diamond heat spreader for high power diode laser (LD) is presented. The design mainly discusses heat sink made of pure copper plates with micro-channels of three sizes (75 μm, 150 μm and 300 μm). And the design is simulated with Computational Fluid Dynamics (CFD) and Numerical Heat Transfer (NHT) methods, the influences of the size, numbers of the cooling channels and the flow rate of the cooling water to the temperature and the flow resistance characteristics of the heat sink are investigated. In general, decreasing of characteristic size, or, increasing of channel numbers, or, increasing of the flow rate of the cooling water can reduce thermal resistance of heat sink; meanwhile increase the pressure drop significantly. The performance with a diamond heat spreader is numerical calculated for all three sizes of micro-channels as well. The results indicate that the diamond heat spreader can play an important role on decreasing the maximum temperature of the heat sink. The whole thermal resistance of heat sink can be reduced 10 % to 20 % with a 100 μm thickness diamond heat spreader compared with a heat sink without it.

Date Published: 15 October 2012
PDF: 8 pages
Proc. SPIE 8419, 6th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optoelectronic Materials and Devices for Sensing, Imaging, and Solar Energy, 841910 (15 October 2012); doi: 10.1117/12.979795

Published in SPIE Proceedings Vol. 8419:
6th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optoelectronic Materials and Devices for Sensing, Imaging, and Solar Energy
Yadong Jiang; Zhifeng Wang; Junsheng Yu, Editor(s)