Share Email Print

Proceedings Paper

Packaging Considerations For Semiconductor Laser Diodes
Author(s): Alan J. Perryman; James D. Regan; Ross T. Elliott
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

The design considerations involved in the primary packaging of semiconductor laser diodes are major factors in the performance, reliability, cost and ultimate commercial success or failure of the finished device. The requirements of the package are as varied as the uses to which semiconductor laser diodes are put; they include such considerations as physical outline, ruggedness, mechanical stability, thermal efficiency, electrical characteristics, unit cost, and handlability. The experience gained by device designers and manufacturers through development and commercial production of semiconductor laser diodes provides the data base from which design proposals are made for new products. However, performance requirements are increasing significantly beyond previous experience and both chip and packaging design engineers are having to turn to new materials and novel design methods to meet these challenges.

Paper Details

Date Published: 22 June 1989
PDF: 8 pages
Proc. SPIE 1043, Laser Diode Technology and Applications, (22 June 1989); doi: 10.1117/12.976388
Show Author Affiliations
Alan J. Perryman, STC Defence Systems (England)
James D. Regan, STC Defence Systems (England)
Ross T. Elliott, STC Defence Systems (England)

Published in SPIE Proceedings Vol. 1043:
Laser Diode Technology and Applications
Luis Figueroa, Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?