A three dimensional architecture is described using optical sources and detectors to interconnect integrated circuit layers. By stacking circuit planes and communicating through optical vias, substantial savings are realized in volume and cost along with increases in density and speed. Highly parallel architectures and efficient hardware for array processing are now possible using technologies that are rapidly becoming practical and available.

Date Published: 23 March 1986
PDF: 6 pages
Proc. SPIE 0698, Real-Time Signal Processing IX, (23 March 1986); doi: 10.1117/12.976270

Published in SPIE Proceedings Vol. 0698:
Real-Time Signal Processing IX
William J. Miceli, Editor(s)