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Proceedings Paper

The Mechanism Of The Desire Process
Author(s): B. Roland; R. Lombaerts; C. Jakus; F. Coopmans
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Paper Abstract

Multilayer resist techniques have been studied for several years already. Especially with the trilayer systems very good results can be obtained, but only at the expense of added complexity. Their complexity has caused some reluctance to implement these techniques into IC manufacturing lines. Using the PLASMASK resist in the so called DESIRE process, even better performance can be obtained, without any of the disadvantages of multilayer techniques. The process is based on a silylation which results from the selective diffusion of a silylating agent into the resist matrix. The basic chemistry that enables this differentiation in diffusion is discussed, as well as the principle advantages of the diffusion-controlled process.

Paper Details

Date Published: 17 September 1987
PDF: 7 pages
Proc. SPIE 0811, Optical Microlithographic Technology for Integrated Circuit Fabrication and Inspection, (17 September 1987); doi: 10.1117/12.975597
Show Author Affiliations
B. Roland, UCB Electronics N.V (Belgium)
R. Lombaerts, UCB Electronics N.V (Belgium)
C. Jakus, UCB Electronics N.V (Belgium)
F. Coopmans, IMEC VZW. (Belgium)

Published in SPIE Proceedings Vol. 0811:
Optical Microlithographic Technology for Integrated Circuit Fabrication and Inspection
Harry L. Stover; Stefan Wittekoek, Editor(s)

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