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Proceedings Paper

Practical Photolithography For Modern Semiconductor Production
Author(s): Walter G. Hertlein
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Paper Abstract

The impact of some photolithographic processing parameters on the final production results in the modern semiconductor device manufacture and also their definition, is discussed under the aspect that microlithographic manufacturing processes are working closer to the limits of the technology. Quality engineering includes good characterization of all manufacturing steps, of all used equipment and materials, in order to minimize the appearance of variances arising either from inside or being imported from outside sources. The objective is to have fully controlled and understood processes, which yield well performing semiconductor devices at reasonable costs in todays production and which will allow further technological progress in the microelectronics industry.

Paper Details

Date Published: 17 September 1987
PDF: 7 pages
Proc. SPIE 0811, Optical Microlithographic Technology for Integrated Circuit Fabrication and Inspection, (17 September 1987); doi: 10.1117/12.975596
Show Author Affiliations
Walter G. Hertlein, Shipley Europe Ltd. (Switzerland)

Published in SPIE Proceedings Vol. 0811:
Optical Microlithographic Technology for Integrated Circuit Fabrication and Inspection
Harry L. Stover; Stefan Wittekoek, Editor(s)

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