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Proceedings Paper

Submicron Resolution Automated Track Development Processes, Part 1: Static Puddle Development
Author(s): Michael K. Templeton; James B. Wickman; Ronald L. Fischer Jr.
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Paper Abstract

Differences between puddle, immersion, and spray development were discussed. Issues affecting submicron profiles were characterized in detail with the aid of both computationally and experimentally generated 0.6 micron (g) profiles. Dissolution rate data for various processes were compared. Modifications to a Perkin-Elmer Development Rate Monitor (DRM) were made to obtain the dissolution rate data; 700nm illumination was used in place of the standard 633nm illumination in order to reduce signal attenuation for low agitation development processes, and the development stage was adapted for use with track processes (puddle). Time and spatial variations in developer temperature accounted for most observed differences between puddle developed and immersion developed profiles. A 3°C drop in the puddle temperature during the course of development produced a substantial alteration in resist profile. Variations in across wafer temperature account for most across wafer critical dimension (CD) variations in puddle processes. No substantial developer depletion effects were observed for single puddle processes. Controlled agitation in immersion development was seen to simultaneously increase photosensitivity and wall angle over non-agitated immersion development.

Paper Details

Date Published: 1 January 1988
PDF: 13 pages
Proc. SPIE 0921, Integrated Circuit Metrology, Inspection, and Process Control II, (1 January 1988); doi: 10.1117/12.968384
Show Author Affiliations
Michael K. Templeton, Monsanto Comoany (United States)
James B. Wickman, Monsanto Company (United States)
Ronald L. Fischer Jr., Monsanto Company (United States)

Published in SPIE Proceedings Vol. 0921:
Integrated Circuit Metrology, Inspection, and Process Control II
Kevin M. Monahan, Editor(s)

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