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Proceedings Paper

A Packaging Technique To Achieve Stable Single-Mode Fiber To Laser Alignment
Author(s): Scott Enochs
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Paper Abstract

A packaging technique that enables a low-loss optical couple between a single-mode laser diode and a single-mode optical fiber has been developed. The technique uses a miniature thin-film substrate with an onboard resistor to mount and subsequently align a lensed and metallized fiber to an emitting laser diode. The resistor serves as a local heat source to first effect the attachment of the fiber to the substrate and second to effect the attachment of the fiber-substrate assembly into aligned position with the laser. Thermal stability of optical couples made with this technique is demonstrated.

Paper Details

Date Published: 17 February 1987
PDF: 6 pages
Proc. SPIE 0703, Integration and Packaging of Optoelectronic Devices, (17 February 1987); doi: 10.1117/12.965188
Show Author Affiliations
Scott Enochs, Tektronix, Inc. (United States)

Published in SPIE Proceedings Vol. 0703:
Integration and Packaging of Optoelectronic Devices
Davis H. Hartman; Robert L. Holman; Doyle P. Skinner, Editor(s)

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