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Proceedings Paper

Packaging Of Semiconductor Optical Amplifiers
Author(s): Robert A. Boudreau; Joanne S. LaCourse
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Paper Abstract

Semiconductor optical amplifier packaging is described using a localized cooling soldering approach for attaching and aligning two separate single mode fibers. The alignment process is more critical for amplifiers than for lasers because fiber coupling loss directly reduces any gain achieved by the semiconductor. The localized cooling method permits use of the same solder at each fiber attachment point eliminating the need for a higher temperature step solder approach. The alignment efficiency or ability of the package to maintain an attached fiber positionally compared to an unattached aligned fiber appears equivalent to what is achievable with laser packages. A description of special issues and problems relevant to the packaging of amplifiers is also presented.

Paper Details

Date Published: 5 January 1990
PDF: 12 pages
Proc. SPIE 1177, Integrated Optics and Optoelectronics, (5 January 1990); doi: 10.1117/12.963340
Show Author Affiliations
Robert A. Boudreau, GTE Laboratories Incorporated (United States)
Joanne S. LaCourse, GTE Laboratories Incorporated (United States)

Published in SPIE Proceedings Vol. 1177:
Integrated Optics and Optoelectronics
Leon McCaughan; Mark A. Mentzer; Song-Tsuen Peng; Henry J. Wojtunik; Ka Kha Wong, Editor(s)

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