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Proceedings Paper

Surface Analysis For The Characterization Of Defects In Thin Film Processes
Author(s): Ramin Lalezari; Robert G. Knollenberg
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Paper Abstract

A surface analysis system commonly used in semiconductor processing is used to characterize microcontamination generated by optical thin film deposition processes. The system is first described and an overview presented of its operation and application when analyzing bare silicon wafers. Bare silicon wafers were used as witness plates to sample microcontamination generated by operations in ion beam sputtering and electron beam evaporation thin film processes. Additional wafers were used to test cleaning methods. The use of the surface analysis system was found to be invaluable in rapidly reducing point defects generated during processes, assessing the cleanliness of work environments, and providing feedback for developing cleaning processes.

Paper Details

Date Published: 20 December 1989
PDF: 14 pages
Proc. SPIE 1164, Surface Characterization and Testing II, (20 December 1989); doi: 10.1117/12.962826
Show Author Affiliations
Ramin Lalezari, Particle Measuring Systems, Inc. (United States)
Robert G. Knollenberg, Particle Measuring Systems, Inc. (United States)

Published in SPIE Proceedings Vol. 1164:
Surface Characterization and Testing II
John E. Greivenkamp; Matthew Young, Editor(s)

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