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Proceedings Paper

Localization Of Failures In Electronic Devices With A Laser Scan Microscope Using A Golden Device Test
Author(s): E. Ziegler
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Paper Abstract

Two methods are described allowing the localization of defects (e.g. hot spots, leakage currents, electrostatic discharge defects) in electric devices using the OBIC (optical beam induced current) signal produced by a laser scan microscope. Knowledges about the generation of the OBIC and the design of the integrated circuit are not needed. In both methods the OBIC signals of a device under test and a good reference device (golden device) are compared. The difference between the two OBIC - images reveals any dissimilarities and in this way localizes defects in a device under test.

Paper Details

Date Published: 28 September 1989
PDF: 4 pages
Proc. SPIE 1139, Optical Storage and Scanning Technology, (28 September 1989); doi: 10.1117/12.961767
Show Author Affiliations
E. Ziegler, ICT GmbH (Germany)

Published in SPIE Proceedings Vol. 1139:
Optical Storage and Scanning Technology
Tony Wilson, Editor(s)

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