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Proceedings Paper

Concept Of Buried Mask And Its Realisation
Author(s): J. P. Panabiere; J. M. Francou; A. Weill; L. Guerin; P. Moschini; M. Pons; A. Inard; G. Amblard
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Paper Abstract

A new method for fabricating photomasks is proposed. The mask is prepared by burying the absorbent patterns inside the transparent photoplate instead of depositing them on the surface of the photoplate. After imaging and etching trenches into the glass substrate, an absorbent material is set into them. Two different ways of filling in these holes are considered: planarisation and lift-off. Various advantages of this technique are expected, namely high resolution. This paper presents results obtained by vacuum contact printing of positive and negative novolak based photoresists exposed through buried masks.

Paper Details

Date Published: 11 October 1989
PDF: 8 pages
Proc. SPIE 1138, Optical Microlithography and Metrology for Microcircuit Fabrication, (11 October 1989); doi: 10.1117/12.961752
Show Author Affiliations
J. P. Panabiere, CNET (France)
J. M. Francou, CNET (France)
A. Weill, CNET (France)
L. Guerin, CNET (France)
P. Moschini, CNET (France)
M. Pons, CNET (France)
A. Inard, CNET (France)
G. Amblard, CNET (France)

Published in SPIE Proceedings Vol. 1138:
Optical Microlithography and Metrology for Microcircuit Fabrication
Michel J. Lacombat; Stefan Wittekoek, Editor(s)

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