Production of MOS/LSI circuits with minimum design rule dimensions of 4-6 microns without complete self-aligning features has provided the opportunity to study several aspects of mask to wafer registration. The mask working tools and wafers can be major contributors to misregistration. Detailed measurements and analysis are presented to illuminate the contribution of mask substrate material and wafer physical characteristics (surface, texture, thickness, crystal type, crystal defects) to misregistration. Conclusions are drawn with regard to the practical solution to misregistration in the production environment. Low expansion substrates for masks and thick (20 mil) wafers provide adequate dimensional control for registration.

Date Published: 5 September 1980
PDF: 8 pages
Proc. SPIE 0221, Developments in Semiconductor Microlithography V, (5 September 1980); doi: 10.1117/12.958629

Published in SPIE Proceedings Vol. 0221:
Developments in Semiconductor Microlithography V
James W. Dey, Editor(s)