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Proceedings Paper

Thick-Film Hybrid Inspection With A Computer-Controlled High Resolution Imaging And Storage System
Author(s): L. Arlan; M. J. Cantella; T. J. Dudziak; M. F. Krayewsky
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Paper Abstract

We have shown that an electro-optical system can be used for automatic quality control inspection of thick-film hybrid circuits. This work was supported by the U.S. Army Electronics R&D Command under Contract No. DAAB07-77-C-0585 entitled "Automatic In-Process Microcircuit Evaluation." A high resolution (10,000 TVL/H) Return Beam Viaicon (RBV) is used to image an entire 2-inch by 2-inch substrate. The RBV is operated witn computer controlled electronic steering and zoom to provide an appropriate level of detail for rapid sequential frame inspection. Video from each frame is compared with that trom a referenced image stored on a video disc. Differences are displayed on a color TV monitor and processed by the computer to identify and characterize faults. Various manual ana automatic inspection sequences can be programmed readily. This technique can inspect hybrid substrates at rates of 750 per hour, and its efficiency makes 100% inspection an economical method for quality control at high through-put rates. This paper describes tree hardware instrumentation and reports functional inspection results achievea using sample hybrid circuits with built-in flaws.

Paper Details

Date Published: 28 May 1980
PDF: 10 pages
Proc. SPIE 0220, Optics in Metrology and Quality Assurance, (28 May 1980); doi: 10.1117/12.958590
Show Author Affiliations
L. Arlan, RCA/Government Systems Division (United States)
M. J. Cantella, RCA/Government Systems Division (United States)
T. J. Dudziak, RCA/Government Systems Division (United States)
M. F. Krayewsky, RCA/Government Systems Division (United States)

Published in SPIE Proceedings Vol. 0220:
Optics in Metrology and Quality Assurance
Harvey L. Kasdan, Editor(s)

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