This paper describes a system which optically and automatically inspects various defects in a screen-printed micro circuit pattern, comparing the scanned data with pertinent stored circuit design information during Thick Film Hyblid I.C. Manufacturing. Various defects, such as Open, Short and etc., generally occur on a line in screen-printed patterns. Traditional defect inspection involved a visual inspection because an automated defect inspection was difficult, since line width and edge values in screen-printed patterns are non-uniform. This automated defect inspection system was developed by utilizing a high resolution photoscanner and stored circuit design information. This paper introduces this automated defect inspection system.

Date Published: 27 July 1979
PDF: 4 pages
Proc. SPIE 0189, 13th Intl Congress on High Speed Photography and Photonics, (27 July 1979); doi: 10.1117/12.957650

Published in SPIE Proceedings Vol. 0189:
13th Intl Congress on High Speed Photography and Photonics
Shin-Ichi Hyodo, Editor(s)