Share Email Print

Proceedings Paper

Testing The Mann Type 4800DSWTM Wafer Steppertm
Author(s): William C. Schneider
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

This paper discusses the use of vernier measuring techniques to determine various errors associated with step-and-repeat mechanisms. The design of GCA Burlington's Universal Vernier Test Target is described and the application of this target to measure reduction error, optical distortion, die rotation, system precision, system registration, and stage orthogonality of Mann Type 4800DSW TM Wafer Stepper TM systems is explained. Test results for recent instruments are given and compared to the manufacturer's specifications.

Paper Details

Date Published: 17 July 1979
PDF: 9 pages
Proc. SPIE 0174, Developments in Semiconductor Microlithography IV, (17 July 1979); doi: 10.1117/12.957172
Show Author Affiliations
William C. Schneider, GCA/Burlington Division (United States)

Published in SPIE Proceedings Vol. 0174:
Developments in Semiconductor Microlithography IV
James W. Dey, Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?