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Proceedings Paper

1 to 3 µm Lithography: How?
Author(s): Jim Dey; Bill Tobey; Peter Moller; Norm Austin; Sam Harrell
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Paper Abstract

Good evening and welcome to our panel discussion this evening, on the subject of "1 to 3 μm Lithography: How?" 1 to 3 micrometers is a range we have been talking about for years. Back, in 1963 when I first got into the industry, people were talking about doing one micron geometries. Personally, I was a little bit awed by this, because I had never been able to make them. I didn't know anyone personally who had ever made them. But everybody was talking about it. Well, suddenly we find ourselves in the situation that we honestly have to start making geometries in the 1 to 3 micrometer range. We are going to have to start doing it in large volumes, economically, soon. And that is the subject we would like to talk about tonight. For our panelists this evening, we have Peter Moller, the Director of Marketing Semiconductor Products, Electro-Optical Divi-sion of Perkin-Elmer Corporation; Bill Tobey, the Director of Marketing of GCA Corporation, Burlington, the manufacturer of DW Mann Products; Norm Austin, the Vice President and General Manager of the Industrial Products Division of ETEC Corporation; Sam Harrell who is Vice President and General Manager of Cobilt Division of Computervision. Tonight's program will start with introductory remarks by each of the panelists. Then I would like to invite all of the members of the audience to participate by asking questions and making comments. Remember, we are all in this thing together. Which is a bit frightening. Believe it or not, these guys are up here to make and sell products. For the most part they are going to make the things that we want to buy, or at least they are going to try to. So it is up to us to tell them what we want; to ask the questions that need to be answered and make suggestions that need to be made. So I guess what I am saying is that"Now is your chance." You have got them all together. They can't tell you how much better their equipment is than the other guy's, because the other guy is sitting right beside him. (I'm not trying to get dirty, I am just trying to get honest.) Anyway, with that as an in-troduction we'll go ahead and let the panelists start out with their in-troductory remarks. They are going to be talking about where they think the industry is going and what their companies can do to help. Then I expect very active participation from the audience. After all, you are the guys who have to do it, and you can't do it without help. Now the members of the panel represent the companies that make the imaging equipment. Not represented on the panel are the people who do the processing and who make the materials. To fill those two voids I would like participation from the audience; those of you who have been involved in Plasma Etching, Ion Beam Milling, the production of photo resist or electron resist products. We can't have everybody on the panel, so I would like very heavy participation in those areas from the audience. So why don't we start off with Peter Moller?

Paper Details

Date Published: 6 September 1978
PDF: 13 pages
Proc. SPIE 0135, Developments in Semiconductor Microlithography III, (6 September 1978); doi: 10.1117/12.956117
Show Author Affiliations
Jim Dey, National Semiconductor Corp. (United States)
Bill Tobey, GCA (United States)
Peter Moller, The Perkin-Elmer Corp. (United States)
Norm Austin, Etec Corp. (United States)
Sam Harrell, Cobilt Div. of Computervision (United States)

Published in SPIE Proceedings Vol. 0135:
Developments in Semiconductor Microlithography III
Dino R. Ciarlo; James W. Dey; Ken Hoeppner, Editor(s)

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