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Proceedings Paper

Automated Inspection Of IC Photomasks
Author(s): D. R. Ciarlo; P. A. Schultz; D. B. Novotny
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Paper Abstract

The results of a nationwide review of automated IC photomask inspection methods are presented. Major photomask inspection problems of detection of visual defects and registration errors, and the determination of critical dimensions and photoplate quality are discussed. This review indicates that for high-volume, large-scale integrated circuits, the greatest concern is for the detection of visual defects. Next in order of importance are the detection of registration errors, and then the accurate determination of critical dimensions. Automated inspection systems and technologies currently available for this are discussed including: microdensitometer-digital computer systems, laser beam scanning systems, spatial filtering systems and microscope-television-digital computer systems. Suggested criteria for an ideal photomask inspection system are the simultaneous inspection for 2-μm visual defects, the determination of registration tolerances to within ±0.5 μm and the determination of the accuracy of the critical dimensions to tolerances of ±0.5 μm on a single photomask in ten minutes.

Paper Details

Date Published: 1 March 1974
PDF: 6 pages
Proc. SPIE 0055, Technological Advances in Micro and Submicro Photofabrication Imagery, (1 March 1974); doi: 10.1117/12.954254
Show Author Affiliations
D. R. Ciarlo, Lawrence Livermore Laboratory (United States)
P. A. Schultz, Lawrence Livermore Laboratory (United States)
D. B. Novotny, National Bureau of Standards (United States)

Published in SPIE Proceedings Vol. 0055:
Technological Advances in Micro and Submicro Photofabrication Imagery
William Converse; J. M. Graf, Editor(s)

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