Proceedings Paper
A Process Evaluation Of Gaf Microline Photoresist - PR 102| Format | Member Price | Non-Member Price |
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Paper Abstract
Increasing demands for minimizing defect density in wafer processing have resulted in a significant emphasis on non-contact printing of the photoresist using either a proximity or projection mode of align-ment. Correspondingly, the need for shrinking geometry sizes to increase packing density and improve device performance is very important in coping with the complexity of LSI devices.
Paper Details
Date Published: 1 March 1974
PDF: 6 pages
Proc. SPIE 0055, Technological Advances in Micro and Submicro Photofabrication Imagery, (1 March 1974); doi: 10.1117/12.954242
Published in SPIE Proceedings Vol. 0055:
Technological Advances in Micro and Submicro Photofabrication Imagery
William Converse; J. M. Graf, Editor(s)
PDF: 6 pages
Proc. SPIE 0055, Technological Advances in Micro and Submicro Photofabrication Imagery, (1 March 1974); doi: 10.1117/12.954242
Show Author Affiliations
Chris Ladas, Motorola Semiconductor Products, Inc. (United States)
Published in SPIE Proceedings Vol. 0055:
Technological Advances in Micro and Submicro Photofabrication Imagery
William Converse; J. M. Graf, Editor(s)
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