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Proceedings Paper

Matching Management Of Multiple Wafer Steppers Using A Stable Standard And A Matching Simulator
Author(s): M. A. van den Brink; C. G. M. de Mol; H. F. D. Linders; S. Wittekoek
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Paper Abstract

Currently, wafer steppers are capable of routinely meeting a single machine overlay accuracy of 150 nm or less. However, this figure is relatively meaningless in a production environment equipped with multiple machines. The question is how to exploit single machine accuracy in a multiple stepper production environment such that production logistics will be independent of machine allocation. This paper describes the use of a matching management system supported by an overlay simulator and a reference wafer set. Every stepper is measured on a regular basis with respect to a reference wafer to determine possible deviation from the nominal grid. The reference wafers are resistant to multiple use. The simulator can be used to estimate the matching performance between non-measured machine pairs so that the need for particular adjustments can be determined. The theory is completed by an extended overlay budget justified by experimental results and a ten machine overlay experiment.

Paper Details

Date Published: 19 July 1989
PDF: 15 pages
Proc. SPIE 1087, Integrated Circuit Metrology, Inspection, and Process Control III, (19 July 1989); doi: 10.1117/12.953095
Show Author Affiliations
M. A. van den Brink, ASM Lithography BV (The Netherlands)
C. G. M. de Mol, ASM Lithography BV (The Netherlands)
H. F. D. Linders, ASM Lithography BV (The Netherlands)
S. Wittekoek, ASM Lithography BV (The Netherlands)

Published in SPIE Proceedings Vol. 1087:
Integrated Circuit Metrology, Inspection, and Process Control III
Kevin M. Monahan, Editor(s)

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