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Proceedings Paper

A Lithographic Study of Photoresists Containing a Base Soluble Dye
Author(s): M. Cagan; M. Blanco; V. Wise; P. Trefonas III; B. K. Daniels; C. McCants
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Paper Abstract

This paper examines the performance of a specific family of dyed resists. The effect of dye con-centration on the line profiles of a homologous series of positive photoresists is studied. Usable images are obtained with dye concentrations of 0%, 0.4%, and 0.6% (percentage of the formulation). Both standard softbake or a softbake plus post-exposure bake (PEB) processes are used. Resist linewidths and cross-sections are measured on substrates that are representative of those encountered on integrated circuits. Optical exposure and develop simulation parameters (two developers) for this family of resists are also extracted.

Paper Details

Date Published: 30 January 1989
PDF: 20 pages
Proc. SPIE 1086, Advances in Resist Technology and Processing VI, (30 January 1989); doi: 10.1117/12.953064
Show Author Affiliations
M. Cagan, Signetics Company (United States)
M. Blanco, Signetics Company (United States)
V. Wise, Signetics Company (United States)
P. Trefonas III, Aspect Systems Corp. (United States)
B. K. Daniels, Aspect Systems Corp. (United States)
C. McCants, Aspect Systems Corp. (United States)

Published in SPIE Proceedings Vol. 1086:
Advances in Resist Technology and Processing VI
Elsa Reichmanis, Editor(s)

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