Polyimides have many desirable properties for use in the microelectronics industry, including ease of application, excellent planarization capability, and good electrical insulating properties. A polyamic acid that is also an imagable resist simplifies processing by eliminating the need for separate resist application and removal steps. Negative-working polyimide resists are quite common, but there are very few examples of positive-working polyimide-based resists. In this paper, we describe a positive polyimide resist which is based upon a diazonaphthoquinone dissolution inhibitor that is standard in the resist industry. The positive polyimide resist described here has high resolution, high heat resistance, and excellent dielectric properties.

Date Published: 30 January 1989
PDF: 10 pages
Proc. SPIE 1086, Advances in Resist Technology and Processing VI, (30 January 1989); doi: 10.1117/12.953052

Published in SPIE Proceedings Vol. 1086:
Advances in Resist Technology and Processing VI
Elsa Reichmanis, Editor(s)