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Proceedings Paper

Improved Thermal Stability Of High Resolution Positive Photoresists Via Elevated Softbake Temperatures
Author(s): Marc T. Aronhime; Chava Gal; Shoshana Silady; John J. Grunwald; Donald W. Johnson; Theodore A. Martin Jr.; Allen C. Spencer; David A. Sawoska
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Paper Abstract

This paper describes the effect of elevated softbake temperatures, up to 150°C, on the behavior of diazoquinone/novolac high resolution positive photoresists. The advantages of higher softbakes include improved thermal stablity, contrast and process latitude. For a standard g-line photoresist using a 2,1,5-diazo/THBP PAC (EPA-914-27, MacDermid Inc.), it was found that by increasing the softbake from 110° to 130°C, gamma increased from 2.4 to 3.8 and the thermal stability (the start of image rounding) increased from 120° to 130°C; while the required exposure energy increased by only about 30%. UV absorption revealed that about 90% (compared to 110°C softbake) of the diazo is retained at 130°C, and about 55% at 150°C. GPC analysis showed that resin/PAC reactions occurred to some extent at a softbake of 130°C, and extensively at 150°C. These resin/PAC interactions appear to be the source of the improved properties observed with higher softbake temperatures. Similar results were not found with 2,1,4-type resin. Several other systems were also investigated to further understand the photoresist chemistry.

Paper Details

Date Published: 30 January 1989
PDF: 9 pages
Proc. SPIE 1086, Advances in Resist Technology and Processing VI, (30 January 1989); doi: 10.1117/12.953022
Show Author Affiliations
Marc T. Aronhime, MacDermid Israel Ltd. (Israel)
Chava Gal, MacDermid Israel Ltd. (Israel)
Shoshana Silady, MacDermid Israel Ltd. (Israel)
John J. Grunwald, MacDermid Israel Ltd. (Israel)
Donald W. Johnson, MacDermid Incorporated (United States)
Theodore A. Martin Jr., MacDermid Incorporated (United States)
Allen C. Spencer, MacDermid Incorporated (United States)
David A. Sawoska, MacDermid Incorporated (United States)

Published in SPIE Proceedings Vol. 1086:
Advances in Resist Technology and Processing VI
Elsa Reichmanis, Editor(s)

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