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Proceedings Paper

Combining Thermographic, Environmental And Functional Testing For Characterization And Performance Measurement Of Electronic Devices And Assemblies
Author(s): Herb Boulton
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Paper Abstract

Thermography is certainly not a new science. For several decades, thermal imagers have been used to evaluate the performance of industrial systems and to diagnose problems which manifest themselves through the propagation of heat patterns. Many different types of thermal imagers have been produced to satisfy the requirements of a wide variety of applications. This paper discusses the design requirements and parameters of thermal imaging systems developed specifically for industrial applications, particularly those involving electronic device testing. It discusses the performance criteria required in thermography systems to adequately conduct conformance testing of electronic components and assemblies. The integration of thermography systems with other functional test equipment and with peripheral devices is reviewed, and the use of these systems in present and future industrial applications is discussed. Emphasis is placed on the cost effective use of thermography to improve yield, enhanced system reliability and provide the capability for developing performance documentation.

Paper Details

Date Published: 28 March 1986
PDF: 7 pages
Proc. SPIE 0581, Thermosense VIII: Thermal Infrared Sensing for Diagnostics and Control, (28 March 1986); doi: 10.1117/12.950889
Show Author Affiliations
Herb Boulton, UTI Instruments Company (United States)

Published in SPIE Proceedings Vol. 0581:
Thermosense VIII: Thermal Infrared Sensing for Diagnostics and Control
Herbert Kaplan, Editor(s)

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