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Proceedings Paper

Application Of Holographic Interferometry Supported By FEM-Calculations During The Development Of A New Assembly Technique
Author(s): H Borner; M Schulz; J. Villain; H Steinbichler
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Paper Abstract

In modern assembly techniques in order to contact a large multilayer circuit board,complex connectors are necessary. To guarantee a sufficiently high, uniformly distributed contact pressure the knowledge of the deformation of the components under working conditions is indispensible. In the first part of the investigation the deformations were measured with the aid of holographic interferometry. The load on the components was increased in steps and therefore through summation a large total of the stresses in the components via the finite element method (FEM) can be combined with the results of the component surface and the values ob tained experimentally agree well with each other. With the help of this experimentally confirmed model the stresses and deformations can also be calculated for places inside the component that can not be measured at all or only with very costly, time-consuming methods.

Paper Details

Date Published: 31 March 1989
PDF: 5 pages
Proc. SPIE 1026, Holography Techniques and Applications, (31 March 1989); doi: 10.1117/12.950242
Show Author Affiliations
H Borner, Siemens AG (FRG)
M Schulz, Siemens AG (FRG)
J. Villain, Siemens AG (FRG)
H Steinbichler, Siemens AG (FRG)

Published in SPIE Proceedings Vol. 1026:
Holography Techniques and Applications
Werner P. O. Jueptner, Editor(s)

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