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Proceedings Paper

High Throughput Cryogenic And Room Temperature Testing Of Focal Plane Components
Author(s): Stanley Voynick
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Paper Abstract

To increase production efficiency in the manufacture of infrared focal plane components, test techniques were refined to enhance testing throughput and accuracy. The result is an integrated package of high performance hardware and software tools which performs well in high throughput production environments. The test system is also very versatile. It has been used for readout (multiplexer) device characterization, room temperature automated wafer probing, and focal plane array (FPA) testing. Tests have been performed using electrical and radiometric optical stimulus. An integrated, convenient software package was developed and is used to acquire, reduce, analyze, display, and archive test data. The test software supports fully automated operation for the production environment, as well as menu-driven operation for R&D, characterization and setup purposes. Trade-offs between handling techniques in cryogenic production testing were investigated. " atch processing" is preferred over "continuous flow", primarily due to considerations of contamination of the cryogenic environment.

Paper Details

Date Published: 27 April 1988
PDF: 8 pages
Proc. SPIE 0973, Cryogenic Optical Systems and Instruments III, (27 April 1988); doi: 10.1117/12.948368
Show Author Affiliations
Stanley Voynick, Amber Engineering, Inc (United States)

Published in SPIE Proceedings Vol. 0973:
Cryogenic Optical Systems and Instruments III
Ramsey K. Melugin; Warren G. Pierce, Editor(s)

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