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Proceedings Paper

Millimeter Wave Subassembly Packaging Techniques
Author(s): Harlan Howe Jr.
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Paper Abstract

Affordable Packaging Techniques usable at Millimeter wave frequencies, for application in radios, munitions, and missiles are discussed. Specific examples of several techniques are presented, and the interaction of these techniques with the emerging technology of monolithic millimeter wave integrated circuits is discussed.

Paper Details

Date Published: 24 October 1985
PDF: 4 pages
Proc. SPIE 0544, Millimeter Wave Technology III, (24 October 1985); doi: 10.1117/12.948257
Show Author Affiliations
Harlan Howe Jr., MlA-COM, Incorporated (United States)

Published in SPIE Proceedings Vol. 0544:
Millimeter Wave Technology III
James C. Wiltse, Editor(s)

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