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Proceedings Paper

An Ultra High Temperature Positive Photoresist
Author(s): John Grunwald; Edwin J. Turner; Allen C. Spencer; David A. Sawoska; Giyora Ben-Shushan
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Paper Abstract

This paper discusses the functional performance features of a new positive photoresist designated as ULTRAMAC' PR78T that can be subjected to temperatures up to 220°C. without any changes in the critical dimensions (CD's). No deep UV stabilization, intermediate post bakes, or other stabilization techniques are required to achieve high temperature thermal stability (220°C.). This high temperature positive photoresist is based on a diazo-coupled alkali soluble resin. The resolution and photospeed of this resist, ULTRAMAC' PR78T, are shown to be in the order of 1 micron using a 1.5 microns resist film thickness at 44 mJ/cm2. This resist also has submicron capabilities using step-and-repeat exposure equipment (10:1) utilizing monochromatic 436 nanometer light. ULTRAMAC' PR78T resist shows optimum sensitivity in the 300 - 500 nanometer UV spectral range. In contact or projection exposure equipment, resolution in the order of 1 micron can be achieved using a 1 micron resist film with exposure energies of about 35 mJ/cm2. For steppers using monochromatic light at 436 nanometers, typical exposure energies are in the order of 160 to 180 mJ/cm2, using either metal-ion-free or buffered metal based developers. Contrast (gamma) curves are shown for both metal-ion-free developer, ULTRAMAC' MF72A, and buffered metal containing developer, ULTRAMAC" D71A. High current ion implant data is also presented, showing no resist degradation. Anisotropic plasma/RIE etching selectivity data is also shown on SiO2 and aluminum alloy substrates.

Paper Details

Date Published: 18 April 1985
PDF: 9 pages
Proc. SPIE 0539, Advances in Resist Technology and Processing II, (18 April 1985); doi: 10.1117/12.947843
Show Author Affiliations
John Grunwald, MacDermid Incorporated (United States)
Edwin J. Turner, MacDermid Incorporated (United States)
Allen C. Spencer, MacDermid Incorporated (United States)
David A. Sawoska, MacDermid Incorporated (United States)
Giyora Ben-Shushan, MacDermid Incorporated (United States)

Published in SPIE Proceedings Vol. 0539:
Advances in Resist Technology and Processing II
Larry F. Thompson, Editor(s)

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