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Proceedings Paper

Optical Interconnects For Multiprocessors
Author(s): John A. Neff
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Paper Abstract

Advances in the performance of electronic devices for computing and signal processing are being largely negated by problems associated with interconnecting these devices to form systems. Metallic interconnects are proving to be more and more costly, especially with respect to processing speeds. The use of optical beams in place of electronic streams is very appealing from several viewpoints. Current technology can provide multi-gigahertz bandwidths for the interconnect channels and can support many times the fan-out as compared to electronics. Significant gains will also be realized in reduced cross-talk and in the power required to drive longer links. Also, optical interconnections between chips need no longer be constrained to the plane of chip carriers and boards, and can cross one another without interfering, thereby leading to a much higher density of interconnects.

Paper Details

Date Published: 8 September 1988
PDF: 6 pages
Proc. SPIE 0947, Interconnection of High Speed and High Frequency Devices and Systems, (8 September 1988); doi: 10.1117/12.947441
Show Author Affiliations
John A. Neff, Defense Advanced Research Projects Agency (United States)

Published in SPIE Proceedings Vol. 0947:
Interconnection of High Speed and High Frequency Devices and Systems
Alfred P. DeFonzo, Editor(s)

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