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Proceedings Paper

An Overview Of Surface Analysis Techniques And Their Applications In The Semiconductor Industry (New Developments In Esca)
Author(s): Donna K. Bakale; Robert Linder; Charles E. Bryson III
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Paper Abstract

Materials characterization, using surface analysis and depth profiling techniques, plays a vital role in all aspects of semiconductor technology from basic research to manufacturing. The techniques are: SEM/EDX/WDX - Scanning Electron Microscopy/Energy Dispersive X-ray/Wavelength Dispersive X-ray AES - Auger Electron Spectroscopy ESCA - Electron Spectroscopy for Chemical Analysis SIMS - Secondary Ion Mass Spectrometry RBS - Rutherford Backscattering Spectrometry LIMS - Laser Ionization Mass Spectrometry Chemical and elemental analysis of the first several atomic layers of a surface are performed. Detection limits range from less than a part per million to several atomic per cent, and areas of analysis can be as small as 5000 Angstroms in diameter. SEM capabilities provide topographical information at magnifications up to 200,000x. An overview of these surface analysis techniques will be presented with an emphasis on the wide range of applications in the semiconductor industry. Recent advances in one technique in particular, ESCA, will be discussed.

Paper Details

Date Published: 28 June 1985
PDF: 11 pages
Proc. SPIE 0524, Spectroscopic Characterization Techniques for Semiconductor Technology II, (28 June 1985); doi: 10.1117/12.946313
Show Author Affiliations
Donna K. Bakale, Surface Science Laboratories, Inc. (United States)
Robert Linder, Surface Science Laboratories, Inc. (United States)
Charles E. Bryson III, Surface Science Laboratories, Inc. (United States)

Published in SPIE Proceedings Vol. 0524:
Spectroscopic Characterization Techniques for Semiconductor Technology II
Fred H. Pollak; Raphael Tsu, Editor(s)

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