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Proceedings Paper

Thermal Stress Analysis Of Brake System Components
Author(s): Robert G. Dubensky; Charles C. Roberts Jr.
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Paper Abstract

Rapid application of automotive brakes causes high temperatures with resulting thermal gradients. To analyze these components accurately, the inputs and heat transfer coefficients must be known. Transient thermal patterns measured on prototype parts were recorded on video tape using an infrared scanner. These temperature values were used as inputs for a finite element analysis to predict component stresses. This test series also showed that infrared thermography can be used to detect the development of thermal cracks in a component.

Paper Details

Date Published: 20 March 1985
PDF: 6 pages
Proc. SPIE 0520, Thermosense VII: Thermal Infrared Sensing for Diagnostics and Control, (20 March 1985); doi: 10.1117/12.946144
Show Author Affiliations
Robert G. Dubensky, Kelsey-Hayes Corporation (United States)
Charles C. Roberts Jr., Consulting Engineers Inc. (United States)

Published in SPIE Proceedings Vol. 0520:
Thermosense VII: Thermal Infrared Sensing for Diagnostics and Control
Andronicos G. Kantsios, Editor(s)

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