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Proceedings Paper

Improved Optical Performance Near The Butt Regions Of Multichip Focal Planes
Author(s): R T Strong; K F Kinnard
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Paper Abstract

A procedure has been developed to improve optical characteristics at the butted edges of linear multichip, focal plane, imaging arrays. The focal plane array is a backside illuminated pushbroom sensor that has been developed for application in remote sensing instruments. The gap between sensor modules making up the array represents a discontinuity in the refractive index of the substrate material through which optical radiation must pass. This discontinuity can produce vignetting and optical crosstalk in the vicinity of the butted regions. Artifacts observed in imagery obtained from a prototype multichip focal plane array suggest that the optical crosstalk in the butt region can be significant. Theory indicates the optical crosstalk can be significantly reduced by filling the gap with a material that has an index of refraction more closely matched to that of the substrate. This is supported by the ex-perimental data. The device butt edge performance with and without epoxy filler(s) has been measured and the technique(s) for epoxy application have been examined.

Paper Details

Date Published: 12 October 1988
PDF: 6 pages
Proc. SPIE 0924, Recent Advances in Sensors, Radiometry, and Data Processing for Remote Sensing, (12 October 1988); doi: 10.1117/12.945670
Show Author Affiliations
R T Strong, GE Advanced fechnology Laboratories (United States)
K F Kinnard, GE Advanced Technology Laboratories (United States)

Published in SPIE Proceedings Vol. 0924:
Recent Advances in Sensors, Radiometry, and Data Processing for Remote Sensing
Philip N. Slater, Editor(s)

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