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Proceedings Paper

Wafer-Scale Integration Of LiNbO3 Components For Coherent Optical Signal Processing
Author(s): R. C. Booth; K. H. Cameron; P. G. Flavin; B. E. Daymond-John
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Paper Abstract

A novel CAD system for use in the manufacture of high resolution chrome masks for wafer scale integrated optic devices is described. The etching of titanium waveguide structures is considered and it is demonstrated that SF6, plasma etching techniques can be used to advantage. The packaging requirements of water scale integrated optic structures are out-lined and a novel fibre attachment technique described.

Paper Details

Date Published: 29 January 1985
PDF: 7 pages
Proc. SPIE 0517, Integrated Optical Circuit Engineering I, (29 January 1985); doi: 10.1117/12.945159
Show Author Affiliations
R. C. Booth, British Telecom Research Laboratories (United Kingdom)
K. H. Cameron, British Telecom Research Laboratories (United Kingdom)
P. G. Flavin, British Telecom Research Laboratories (United Kingdom)
B. E. Daymond-John, British Telecom Research Laboratories (United Kingdom)

Published in SPIE Proceedings Vol. 0517:
Integrated Optical Circuit Engineering I
Daniel B. Ostrowsky; Sriram Sriram, Editor(s)

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