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Proceedings Paper

Optical Interconnections For Wafer-Scale Integrated And Hybrid-Wafer-Scale Integrated Architectures
Author(s): L. A. Hornak
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Paper Abstract

With the considerable work currently underway to apply optical interconnections within electronic systems, 1I it is of interest to examine how the system architecture impacts potential applications. The use of optical interconnections is very application specific, thus far, primarily being used to relieve pin-out constraints within high speed systems.[21 131 These very same high performance systems are sensitive to EMI making optical interconnections even more attractive. Another proposed application is for distribution of system clock signals within synchronous systems. [4]

Paper Details

Date Published: 10 March 1988
PDF: 6 pages
Proc. SPIE 0835, Integrated Optical Circuit Engineering V, (10 March 1988); doi: 10.1117/12.942371
Show Author Affiliations
L. A. Hornak, AT&T Bell Laboratories (United States)

Published in SPIE Proceedings Vol. 0835:
Integrated Optical Circuit Engineering V
Mark A. Mentzer, Editor(s)

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