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Proceedings Paper

Noncontact Testing Of Integrated Circuits Using An Electron Beam Probe
Author(s): E. Menzel; R. Buchanan
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Paper Abstract

The complexity of integrated circuits (ICs) is steadily growing, and geometries are shrinking. This is as a result of the demand for higher speed, greater reliability, increased capability, and decreased cost. With growing complexity, the testing of an IC is rendered more difficult and increasingly determines IC cost. Classical test methods have been improved and new testing strategies are currently being developed, aiming at keeping development times of ICs at a justifiable level, and at assuring and improving the quality and reliability of ICs. One of the new test methods that has received a tremendous impetus in the past few years is electron beam testing. The attractive properties of an eletron beam lie in its capability of being used as a finely focused, easily alignable contactless probe, which under certain conditions can measure IC-internal signals in a nonloading and nondestructive way. Thus the e-beam represents the only alternative to the mechanical probe used so far for electrical signal measurements in medium-scale (MSI) and large-scale integrated circuits (LSI). This paper reviews the fundamental operating principles of E-beam Testing. Included is data obtained using a recently developed secondary electron analyzer located within the final probe-forming lens of a scanning electron microscope. These results show a substantial improvement in both spatial and energy resolution, as well as measurement accuracy.

Paper Details

Date Published: 2 February 1988
PDF: 13 pages
Proc. SPIE 0795, Characterization of Very High Speed Semiconductor Devices and Integrated Circuits, (2 February 1988); doi: 10.1117/12.940973
Show Author Affiliations
E. Menzel, Applied Beam Technology, Inc. (United States)
R. Buchanan, Applied Beam Technology, Inc. (United States)

Published in SPIE Proceedings Vol. 0795:
Characterization of Very High Speed Semiconductor Devices and Integrated Circuits
Ravinder K. Jain, Editor(s)

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