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Proceedings Paper

Nondestructive Imaging And Characterizations Of Electronic Materials And Devices Using Scanning Acoustic Microscopy
Author(s): Chen S. Tsai; Chin C. Lee
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Paper Abstract

In this paper, a description of the scanning acoustic microscope (SAM) is first given to be followed by a brief and selective review of the recent applications of the SAM in nondestructive study of solid-state materials and devices. Some of the recent progress on the imaging and the methodologies for quantitative characterization of thin-and thick-solid state electronic materials and devices that are being made at the authors' institution is stressed.

Paper Details

Date Published: 10 September 1987
PDF: 7 pages
Proc. SPIE 0768, Pattern Recognition and Acoustical Imaging, (10 September 1987); doi: 10.1117/12.940276
Show Author Affiliations
Chen S. Tsai, University of California (United States)
Chin C. Lee, University of California (United States)

Published in SPIE Proceedings Vol. 0768:
Pattern Recognition and Acoustical Imaging
Leonard A. Ferrari, Editor(s)

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