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Proceedings Paper

Automated Visual Integrated Circuit Mounting Operations Inspections
Author(s): Michel Chapron
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Paper Abstract

The paper deals with visual inspections which take place on integrated-circuit assembly lines after the following operations : die-bonding, wire bonding, lid sealing, package marking. Ceramic package inspection is also described. An X-ray camera enables us to inspect eutectic die bondings or epoxy die bondings. Different defect types are detected by using mainly 2 methods : the former is based on classical processings, the latter is based on unusual projections. Photographs, obtained by an ultra-sonic microscope, show the power of this new means of die-bonding inspection. The microscope permits sufficient magnification in order to inspect the wire-bonding. The method presented is primarily based on mathematical morphology. The inspection of lid sealing consists of two inspections : lid centering inspection and joint inspection. The method proposed for solving the first inspection is based on mathematical morphology, projections, Hough transform, and is available for different types and sizes of packages. It is also invariant in translation and rotation. The second inspection is mainly based on mathematical morphology. Two methods are proposed for solving package marking inspection : the first one is based on mathematical morphology, the other one on a Bayesian method. The final inspection, ceramic package integrity inspection, which is made with a horizontal lighting, is based on classical processings and mathematical morphology.

Paper Details

Date Published: 18 May 1987
PDF: 8 pages
Proc. SPIE 0730, Automated Inspection and Measurement, (18 May 1987); doi: 10.1117/12.937871
Show Author Affiliations
Michel Chapron, Laboratoire d'Automatique et d'Analyse des Systemes du C.N.R.S. (France)

Published in SPIE Proceedings Vol. 0730:
Automated Inspection and Measurement
Michael J. W. Chen; Robert H. Thibadeau, Editor(s)

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