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Proceedings Paper

High Reliability Packaging For Fibre Optic Sources
Author(s): A Rosiewicz
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Paper Abstract

Packaging is a key element in attaining high reliability in fiber-optic sources and detectors. In many regards, the challenges of developing stable packaging equal or exceed the challenges faced in manufacturing the critical semiconductors elements. For example, in the development of semiconductor elements it is possible to use high temperature lifetests of a few months to allow prediction of room temperature lifetimes of many tens of years. For packaging, such an extrapolation is not straightforward and may not be possible. However, the conventional wisdom is that there is a significant increase in package degradation rates at elevated temperatures. Consequently, it is generally accepted that packaging design efforts should be aimed at techniques which demonstrate good stability at high temperatures.

Paper Details

Date Published: 23 February 1987
PDF: 13 pages
Proc. SPIE 0717, Reliability Considerations in Fiber Optic Applications, (23 February 1987); doi: 10.1117/12.937480
Show Author Affiliations
A Rosiewicz, Consultant (United States)

Published in SPIE Proceedings Vol. 0717:
Reliability Considerations in Fiber Optic Applications
Dilip K. Paul, Editor(s)

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