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Proceedings Paper

VLSI Lithography Using Canon 1:1 Wafer Stepper
Author(s): Venkat Nagaswami; Gail Ungemach; Wayne Hsueh; Murray Trudel
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Paper Abstract

Although wafer stepper technology seems to be the general trend in fabrication of VLSI circuits, the semiconductor industry is still evaluating the relative merits of 1X, 5X and 10X magnification. Field-proven early model reduction steppers are now being challenged by new lower-cost 1:1 steppers with comparable specifications, such as the Canon FPA-112FA. The present study takes a close look at the Canon FPA-112FA 1:1 wafer stepper as a production viable VLSI tool. Results obtained in processing a 2-poly NMOS process (1.7 micron minimum space) are presented.

Paper Details

Date Published: 7 November 1983
PDF: 8 pages
Proc. SPIE 0394, Optical Microlithography II: Technology for the 1980s, (7 November 1983); doi: 10.1117/12.935127
Show Author Affiliations
Venkat Nagaswami, Zilog, Inc. (United States)
Gail Ungemach, Zilog, Inc. (United States)
Wayne Hsueh, Zilog, Inc. (United States)
Murray Trudel, Zilog, Inc. (United States)

Published in SPIE Proceedings Vol. 0394:
Optical Microlithography II: Technology for the 1980s
Harry L. Stover, Editor(s)

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