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Proceedings Paper

Defect And Measurement Evaluation System
Author(s): James F. Cosgrove
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Paper Abstract

The defect and measurement evaluation system represents a successful computer-microscope partnership that has enhanced the visual inspection of LSI wafers during the manufacturing process. Fabrication and process control of small geometry, semiconductor devices demand high quality visual inspection systems and real-time analysis of pattern width measurements, defects and surface characteristics. The defect and measurement evaluation system tool has coupled a high quality, wide-field microscope system to an IBM 5100 computer. This provides an integrated tool controller, real-time data collection and analysis system. With the inspector in mind, the design and packaging of the tool was human-factor-engineered for ease of operation and minimum fatigue.

Paper Details

Date Published: 23 May 1983
PDF: 4 pages
Proc. SPIE 0360, Robotics and Industrial Inspection, (23 May 1983); doi: 10.1117/12.934115
Show Author Affiliations
James F. Cosgrove, IBM General Technology Division (United States)

Published in SPIE Proceedings Vol. 0360:
Robotics and Industrial Inspection
David P. Casasent, Editor(s)

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