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Proceedings Paper

Multispectral Linear Array (MLA) Focal Plane Mechanical And Thermal Design
Author(s): A. S. Mitchell; E. F. Kaminski
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Paper Abstract

The mechanical and thermal design of an integrated focal plane subsystem of a nultispectral Linear Array (MLA) instrument is discussed in terms of focal-plane alignment, thermoelastic performance, and thermal requirements. The modular construction and thermal control of the focal plane array are discussed.

Paper Details

Date Published: 23 November 1982
PDF: 6 pages
Proc. SPIE 0345, Advanced Multispectral Remote Sensing Technology and Applications, (23 November 1982); doi: 10.1117/12.933780
Show Author Affiliations
A. S. Mitchell, Westinghouse Aerospace Division (United States)
E. F. Kaminski, Westinghouse Aerospace Division (United States)

Published in SPIE Proceedings Vol. 0345:
Advanced Multispectral Remote Sensing Technology and Applications
Ken J. Ando, Editor(s)

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